Electronic module having a clip connected to a semiconductor package
US-2025125218-A1 · Apr 17, 2025 · US
Seng Philipp is listed as an inventor on 16 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Seng Philipp |
| Total patents | 16 |
| First publication | Jun 11, 2015 |
| Latest publication | Apr 17, 2025 |
Publications ranked by popularity score, then publication date.
US-2025125218-A1 · Apr 17, 2025 · US
US-2025107115-A1 · Mar 27, 2025 · US
US-12218030-B2 · Feb 4, 2025 · US
US-11276680-B2 · Mar 15, 2022 · US
US-10854598-B2 · Dec 1, 2020 · US
US-2020294885-A1 · Sep 17, 2020 · US
US-10516065-B2 · Dec 24, 2019 · US
US-10164043-B2 · Dec 25, 2018 · US
US-9911808-B2 · Mar 6, 2018 · US
US-2018013013-A1 · Jan 11, 2018 · US
Latest publications not already listed above.
US-9825023-B2 · Nov 21, 2017 · US
US-9768120-B2 · Sep 19, 2017 · US
US-2017229539-A1 · Aug 10, 2017 · US
US-2016133620-A1 · May 12, 2016 · US
US-2016111415-A1 · Apr 21, 2016 · US
US-2015162325-A1 · Jun 11, 2015 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Austria Ag | 7 |
| Infineon Technologies Ag | 6 |
| Infineon Technologies Austria | 3 |
| Infineon Technologies Ag | 1 |
| Mauder Anton | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D8/00 | 6 |
| H01L29/861 | 5 |
| H10D62/60 | 5 |
| H10D8/411 | 5 |
| H10D84/811 | 5 |