Variable pin fin construction to facilitate compliant cold plates
US-11515230-B2 · Nov 29, 2022 · US
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Schultz Mark Delorman patents
Schultz Mark Delorman is listed as an inventor on 22 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Schultz Mark Delorman |
| Total patents | 22 |
| First publication | Mar 15, 2018 |
| Latest publication | Nov 29, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
System level model for pumped two-phase cooling systems
US-11009926-B2 · May 18, 2021 · US
Two-phase liquid cooled electronics
US-10701832-B2 · Jun 30, 2020 · US
System level model for pumped two-phase cooling systems
US-2020166975-A1 · May 28, 2020 · US
Chip package for two-phase cooling and assembly process thereof
US-10607963-B2 · Mar 31, 2020 · US
Variable pin fin construction to facilitate compliant cold plates
US-2020091032-A1 · Mar 19, 2020 · US
System level model for pumped two-phase cooling systems
US-10585462-B2 · Mar 10, 2020 · US
Variable pin fin construction to facilitate compliant cold plates
US-10504814-B2 · Dec 10, 2019 · US
Two-phase liquid cooled electronics
US-10499543-B2 · Dec 3, 2019 · US
Two-phase liquid cooled electronics
US-10244655-B2 · Mar 26, 2019 · US
Recent patents
Latest publications not already listed above.
Wafer level integration for embedded cooling
US-10170392-B2 · Jan 1, 2019 · US
Passive two-phase cooling with forced cooling assist
US-10143109-B2 · Nov 27, 2018 · US
Passive two-phase cooling with forced cooling assist
US-10136554-B2 · Nov 20, 2018 · US
Wafer level integration for embedded cooling
US-2018294205-A1 · Oct 11, 2018 · US
Wafer level integration for embedded cooling
US-2018294206-A1 · Oct 11, 2018 · US
Passive two-phase cooling with forced cooling assist
US-2018288903-A1 · Oct 4, 2018 · US
Passive two-phase cooling with forced cooling assist
US-2018288904-A1 · Oct 4, 2018 · US
Two-phase liquid cooled electronics
US-2018270990-A1 · Sep 20, 2018 · US
Two-phase liquid cooled electronics
US-2018270989-A1 · Sep 20, 2018 · US
System level model for pumped two-phase cooling systems
US-2018088607-A1 · Mar 29, 2018 · US
Chip package for two-phase cooling and assembly process thereof
US-2018076113-A1 · Mar 15, 2018 · US
Variable pin fin construction to facilitate compliant cold plates
US-2018076111-A1 · Mar 15, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 22 |
| Int Bustness Machines Corporation | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/47 | 18 |
| H10W40/43 | 13 |
| H10W40/73 | 12 |
| H05K7/20836 | 9 |
| H05K7/20809 | 9 |