Passive two-phase cooling with forced cooling assist

Patent metadata

Field	Value
Publication number	US-10143109-B2
Application number	US-201715841994-A
Country	US
Kind code	B2
Filing date	Dec 14, 2017
Priority date	Mar 31, 2017
Publication date	Nov 27, 2018
Grant date	Nov 27, 2018

Abstract

Techniques that facilitate two-phase liquid cooling electronics are provided. In one example, a system comprises a pump and a valve. The pump circulates a coolant refrigerant through a two-phase refrigerant system associated with an electronic component. The valve controls a flow path of the coolant refrigerant that flows through the two-phase refrigerant system. Furthermore, the valve modifies the flow path of the coolant refrigerant through the two-phase refrigerant system in response to a determination that an operation of the pump satisfies a defined criterion.

First claim

What is claimed is:

1. A computer-implemented method, comprising:
monitoring, by a system operatively coupled to a processor, one or more sensors associated with a pump that circulates a coolant refrigerant through a two-phase refrigerant system associated with a first electronic component;
modifying, by the system, a flow path of the coolant refrigerant through the two-phase refrigerant system based on a determination that the pump satisfies a defined criterion; and
transmitting, by the system, information associated with the first electronic component to a second electronic component based on the determination that the pump satisfies the defined criterion.

2. The computer-implemented method of claim 1 , wherein the modifying comprises regulating a flow rate of the coolant refrigerant through the pump based on the determination that the pump satisfies the defined criterion.

3. The computer-implemented method of claim 1 , further comprising modifying, by the system, processing frequency of the first electronic component based on the determination that the pump satisfies the defined criterion.

4. The computer-implemented method of claim 1 , further comprising transmitting, by the system, a notification to an electronic device in communication with the system based on the determination that the pump satisfies the defined criterion.

5. The computer-implemented method of claim 4 , wherein the transmitting, by the system, the notification to the electronic device is performed via one or more wireless networks.

6. The computer-implemented method of claim 1 , wherein the modifying comprises improving processing performance of the first electronic component.

7. The computer-implemented method of claim 6 , wherein the improving processing performance of the first electronic component comprises throttling the first electronic component to a power state having a level below a defined threshold.

8. The computer-implemented method of claim 1 , wherein the defined criterion comprises failure of the pump.

9. The computer-implemented method of claim 1 , wherein the defined criterion comprises the pump being turned off.

10. The computer-implemented method of claim 1 , wherein the transmitting the information associated with the first electronic component to the second electronic component reduces a workload of the first electronic component.

11. The computer-implemented method of claim 1 , wherein the first electronic component and the second electronic component are a second processor and a third processor, respectively.

12. The computer-implemented method of claim 1 , wherein the one or more sensors associated with the pump comprise a temperature sensor.

13. The computer-implemented method of claim 1 , wherein the one or more sensors associated with the pump comprise a power usage sensor.

14. The computer-implemented method of claim 1 , wherein the one or more sensors associated with the pump comprise a flow rate sensor.

Assignees

• IBM

Inventors

• Chainer Timothy Joseph
• Parida Pritish Ranjan
• Schultz Mark Delorman

Classifications

• G05D23/1919

  characterised by the type of controller · CPC title

• H05K7/20836

  Thermal management, e.g. server temperature control · CPC title

• H05K7/20809

  within server blades for removing heat from heat source · CPC title

• H05K7/20727

  within server blades for removing heat from heat source · CPC title

• H05K7/2029

  using a liquid coolant with phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954) · CPC title