Two-phase liquid cooled electronics

Patent metadata

Field	Value
Publication number	US-2018270990-A1
Application number	US-201715841752-A
Country	US
Kind code	A1
Filing date	Dec 14, 2017
Priority date	Mar 20, 2017
Publication date	Sep 20, 2018
Grant date	—

Abstract

Techniques that facilitate two-phase liquid cooling electronics are provided. In one example, a server system comprises a two-phase cooling system and an air moving system. The two-phase cooling system reduces a first temperature of a first electronic component in the server system using a pump that circulates a coolant refrigerant through a two-phase refrigerant loop associated with the first electronic component, where first electronic component satisfies a first defined criterion. The air moving system reduces a second temperature of a second electronic component in the server system using one or more fans associated with the second electronic component, where the second electronic component satisfies a second defined criterion.

First claim

1 . A computer-implemented method, comprising:
monitoring, by a system operatively coupled to a processor, one or more sensors associated with a two-phase cooling system that reduces a first temperature of a first electronic component using a pump that circulates a coolant refrigerant through a two-phase refrigerant loop associated with the first electronic component, wherein the two-phase cooling system and an air moving system that reduces a second temperature of a second electronic component using one or more fans are contained in an enclosure; and regulating, by the system, one or more control valves associated with the two-phase cooling system based on data provided by the one or more sensors, wherein the regulating comprises:
regulating a first control valve of the one or more control valves to control a first flow to a heat exchanger in the enclosure, wherein the first control valve is located between a first two-phase cooling device of the two-phase cooling system and the heat exchanger; and
regulating a second control valve of the one or more control valves to control a second flow from the heat exchanger to a condenser in the enclosure, wherein the second control valve is located between the heat exchanger and the condenser.

2 . The computer-implemented method of claim 1 , wherein the monitoring comprises monitoring a temperature associated with the two-phase cooling system.

3 . The computer-implemented method of claim 1 , wherein the monitoring comprises monitoring a flow rate associated with the coolant refrigerant through the two-phase refrigerant loop.

4 . The computer-implemented method of claim 1 , further comprising:
determining, by the system, power usage associated with at least one of the first electronic component or the second electronic component; and regulating, by the system, a flow control valve of the one or more control valves, based on the power usage associated with the at least one of the first electronic component or the second electronic component.

5 . The computer-implemented method of claim 1 , further comprising:
determining, by the system, a temperature associated with an inlet to the enclosure; and identifying, by the system, a flow rate of the coolant refrigerant; and facilitating, by the system, modifying the flow rate of the coolant refrigerant based on the temperature.

6 . The computer-implemented method of claim 1 , further comprising:
determining, by the system, a temperature associated with an inlet to the enclosure; and identifying, by the system, a flow rate of the coolant refrigerant.

7 . The computer-implemented method of claim 1 , further comprising:
facilitating, by the system, modifying the flow rate of the coolant refrigerant based on the temperature.

8 . A computer-implemented method, comprising:
monitoring, by a system operatively coupled to a processor, one or more sensors associated with a two-phase cooling system that reduces a first temperature of a first electronic component using a pump that circulates a coolant refrigerant through a two-phase refrigerant loop associated with the first electronic component; regulating a first control valve of the one or more control valves to control a first flow from a first two-phase cooling device to a heat exchanger in the enclosure; and regulating a second control valve of the one or more control valves to control a second flow from the heat exchanger to a condenser in the enclosure.

9 . The computer-implemented method of claim 8 , wherein the monitoring comprises monitoring a temperature associated with the two-phase cooling system.

10 . The computer-implemented method of claim 8 , wherein the monitoring comprises monitoring a flow rate associated with the coolant refrigerant through the two-phase refrigerant loop.

Assignees

• IBM

Inventors

• Chainer Timothy Joseph
• Parida Pritish Ranjan
• Schultz Mark Delorman

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/43

  by flowing gases, e.g. forced air cooling · CPC title

• H05K7/208

  Liquid cooling with phase change · CPC title

• H05K7/20309

  Evaporators · CPC title