Adhesive composition for flexible printed-wiring board (FPC), and heat-curable resin film, prepreg and FPC substrate containing same
US-12421435-B2 · Sep 23, 2025 · US
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Sasahara Rina patents
Sasahara Rina is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sasahara Rina |
| Total patents | 7 |
| First publication | Sep 29, 2022 |
| Latest publication | Sep 23, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Heat-curable resin composition
US-12110356-B2 · Oct 8, 2024 · US
Heat-curable citraconimide resin composition
US-12012485-B2 · Jun 18, 2024 · US
Heat-curable imide resin composition, and uncured resin film, cured resin film, prepreg, substrate, adhesive and semiconductor encapsulation material using same
US-2024191029-A1 · Jun 13, 2024 · US
Heat-curable resin composition
US-2023067259-A1 · Mar 2, 2023 · US
Adhesive composition for flexible printed-wiring board (fpc), and heat-curable resin film, prepreg and fpc substrate containing same
US-2022306920-A1 · Sep 29, 2022 · US
Heat-curable citraconimide resin composition
US-2022306808-A1 · Sep 29, 2022 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Shinetsu Chemical Co | 7 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C08J5/18 | 5 |
| C08J2379/08 | 5 |
| C09J179/08 | 5 |
| C08J5/24 | 5 |
| C08L79/085 | 5 |