Heat-curable citraconimide resin composition

Patent metadata

Field	Value
Publication number	US-2022306808-A1
Application number	US-202217687420-A
Country	US
Kind code	A1
Filing date	Mar 4, 2022
Priority date	Mar 23, 2021
Publication date	Sep 29, 2022
Grant date	—

Abstract

Provided is a resin composition that has a low viscosity before curing, and is capable of being turned into a cured product having superior dielectric properties (low relative permittivity and low dielectric tangent), a low elastic modulus and also an excellent heat resistance. The resin composition is a heat-curable citraconimide resin composition containing:
(A) a citraconimide compound having a saturated or unsaturated divalent hydrocarbon group(s) having 6 to 100 carbon atoms;
(B) an epoxy resin having at least two epoxy groups in one molecule; and
(C) a reaction promoter,
wherein a mass ratio between the components (A) and (B) is (A):(B)=99:1 to 1:99.

First claim

What is claimed is:

1 . A heat-curable citraconimide resin composition comprising:
(A) a citraconimide compound having a saturated or unsaturated divalent hydrocarbon group(s) having 6 to 100 carbon atoms; (B) an epoxy resin having at least two epoxy groups in one molecule; and (C) a reaction promoter,
wherein a mass ratio between the components (A) and (B) is (A):(B)=99:1 to 1:99.

2 . The heat-curable citraconimide resin composition according to claim 1 , wherein the citraconimide compound as the component (A) is a biscitraconimide compound having two citraconimide groups.

3 . The heat-curable citraconimide resin composition according to claim 1 , wherein the divalent hydrocarbon group is an aliphatic hydrocarbon group.

4 . The heat-curable citraconimide resin composition according to claim 1 , wherein the divalent hydrocarbon group is selected from the saturated hydrocarbon groups having the following structures; and hydrocarbon groups derived from dimer acid frames,

wherein * represents a bond with a nitrogen atom in the citraconimide group, n is 6 to 20.

5 . The heat-curable citraconimide resin composition according to claim 1 , wherein the component (A) is represented by the following formula (1),

wherein B independently represents a cyclic structure-containing tetravalent organic group, Z independently represents a divalent hydrocarbon group having 6 to 100 carbon atoms, m is 0 to 10, provided that the structures of the repeating units identified by m may be identical to or different from each other, and at least one Z has a dimer acid frame-derived structure.

6 . The heat-curable citraconimide resin composition according to claim 5 , wherein in the formula (1), B is any one of the tetravalent organic groups represented by the following structural formulae,

wherein bonds in the above structural formulae that are yet unbonded to substituent groups are to be bonded to carbonyl carbons forming cyclic imide structures in the general formula (1).

7 . The heat-curable citraconimide resin composition according to claim 1 , wherein the reaction promoter as the component (C) is an anionic polymerization initiator containing at least one of a nitrogen and phosphorus atom(s).

8 . An uncured resin film comprised of the heat-curable citraconimide resin composition according to claim 1 .

9 . A cured resin film comprised of a cured product of the heat-curable citraconimide resin composition according to claim 1 .

10 . A prepreg comprising the heat-curable citraconimide resin composition according to claim 1 ; and a fiber base material.

11 . A substrate comprising the heat-curable citraconimide resin composition according to claim 1 .

12 . An adhesive comprised of the heat-curable citraconimide resin composition according to claim 1 .

13 . A semiconductor encapsulant comprised of the heat-curable citraconimide resin composition according to claim 1 .

Assignees

• Shinetsu Chemical Co

Inventors

• Tsutsumi Yoshihiro
• Kushihara Naoyuki
• Sasahara Rina

Classifications

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• C08L2203/206

  use in coating or encapsulating of electronic parts · CPC title

• C08J5/18 Primary

  Manufacture of films or sheets · CPC title

• C09J179/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• C08L79/08 Primary

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title