Heat-curable citraconimide resin composition

Patent metadata

Field	Value
Publication number	US-12012485-B2
Application number	US-202217687420-A
Country	US
Kind code	B2
Filing date	Mar 4, 2022
Priority date	Mar 23, 2021
Publication date	Jun 18, 2024
Grant date	Jun 18, 2024

Abstract

Provided is a resin composition that has a low viscosity before curing, and is capable of being turned into a cured product having superior dielectric properties (low relative permittivity and low dielectric tangent), a low elastic modulus and also an excellent heat resistance. The resin composition is a heat-curable citraconimide resin composition containing:
(A) a citraconimide compound having a saturated or unsaturated divalent hydrocarbon group(s) having 6 to 100 carbon atoms; (B) an epoxy resin having at least two epoxy groups in one molecule; and (C) a reaction promoter,

wherein a mass ratio between the components (A) and (B) is (A):(B)=99:1 to 1:99.

First claim

What is claimed is:

1. A heat-curable citraconimide resin composition comprising:
(A) a citraconimide compound represented by the following formulae (5), (6) or (7),

wherein p is 1 to 10 and C 36 H 72 represents a dimer acid frame,

wherein q is 1 to 10 and C 36 H 72 represents a dimer acid frame;
(B) an epoxy resin having at least two epoxy groups in one molecule; and
(C) a reaction promoter,

wherein a mass ratio between the components (A) and (B) is (A):(B)=99:1 to 1:99.

2. The heat-curable citraconimide resin composition according to claim 1 , wherein the reaction promoter as the component (C) is an anionic polymerization initiator containing at least one of a nitrogen and phosphorus atom(s).

3. An uncured resin film comprised of the heat-curable citraconimide resin composition according to claim 1 .

4. A cured resin film comprised of a cured product of the heat-curable citraconimide resin composition according to claim 1 .

5. A prepreg comprising the heat-curable citraconimide resin composition according to claim 1 ; and a fiber base material.

6. A substrate comprising the heat-curable citraconimide resin composition according to claim 1 .

7. An adhesive comprised of the heat-curable citraconimide resin composition according to claim 1 .

8. A semiconductor encapsulant comprised of the heat-curable citraconimide resin composition according to claim 1 .

9. The heat-curable citraconimide resin composition according to claim 1 , wherein a mass ratio between the components (A) and (B) is (A):(B)=98:2 to 5:95.

10. The heat-curable citraconimide resin composition according to claim 1 , wherein a mass ratio between the components (A) and (B) is (A):(B)=98:2 to 30:70.

11. The heat-curable citraconimide resin composition according to claim 1 , wherein said citraconimide compound is represented by the formula:

12. The heat-curable citraconimide resin composition according to claim 1 , wherein said citraconimide compound is represented by the formula:

wherein p≈3 and C 36 H 72 represents a dimer acid frame.

13. The heat-curable citraconimide resin composition according to claim 1 , wherein said citraconimide compound is represented by the formula:

wherein q≈3 and C 36 H 72 represents a dimer acid frame.

14. The heat-curable citraconimide resin composition according to claim 1 , wherein the epoxy resin of component (B) is solid at 25° C. and has a melting point of 40 to 150° C. or a softening point of 50 to 160° C.

Assignees

• Shinetsu Chemical Co

Inventors

• Tsutsumi Yoshihiro
• Kushihara Naoyuki
• Sasahara Rina

Classifications

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• C08J5/18 Primary

  Manufacture of films or sheets · CPC title

• C08J2379/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• C09J179/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• C08J5/24

  Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs · CPC title