Overmolded microelectronic packages containing knurled flanges and methods for the production thereof
US-12087671-B2 · Sep 10, 2024 · US
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Sanchez Audel patents
Sanchez Audel is listed as an inventor on 21 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sanchez Audel |
| Total patents | 21 |
| First publication | Nov 27, 2018 |
| Latest publication | Sep 10, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Packaged electronic devices with top terminations
US-11343919-B2 · May 24, 2022 · US
Overmolded microelectronic packages containing knurled flanges and methods for the production thereof
US-2021217685-A1 · Jul 15, 2021 · US
Overmolded microelectronic packages containing knurled flanges and methods for the production thereof
US-10998255-B2 · May 4, 2021 · US
Internally-shielded microelectronic packages and methods for the fabrication thereof
US-10861774-B2 · Dec 8, 2020 · US
Internally-shielded microelectronic packages and methods for the fabrication thereof
US-2020211932-A1 · Jul 2, 2020 · US
Internally-shielded microelectronic packages and methods for the fabrication thereof
US-10629518-B2 · Apr 21, 2020 · US
Internally-shielded microelectronic packages and methods for the fabrication thereof
US-2020075463-A1 · Mar 5, 2020 · US
Overmolded microelectronic packages containing knurled flanges and methods for the production thereof
US-2020020614-A1 · Jan 16, 2020 · US
Molded air cavity packages and methods for the production thereof
US-10529638-B2 · Jan 7, 2020 · US
Recent patents
Latest publications not already listed above.
Methods of manufacturing packaged electronic devices with top terminations
US-2019343005-A1 · Nov 7, 2019 · US
Molded air cavity packages and methods for the production thereof
US-10396006-B2 · Aug 27, 2019 · US
Molded air cavity packages and methods for the production thereof
US-2019109060-A1 · Apr 11, 2019 · US
Die crack detector and method therefor
US-10241151-B2 · Mar 26, 2019 · US
Molded air cavity packages and methods for the production thereof
US-2019051571-A1 · Feb 14, 2019 · US
Molded air cavity packages and methods for the production thereof
US-2019043775-A1 · Feb 7, 2019 · US
Molded air cavity packages and methods for the production thereof
US-2019043774-A1 · Feb 7, 2019 · US
Molded air cavity packages and methods for the production thereof
US-10199303-B1 · Feb 5, 2019 · US
Molded air cavity packages and methods for the production thereof
US-10199302-B1 · Feb 5, 2019 · US
Die crack detector and method therefor
US-2019033365-A1 · Jan 31, 2019 · US
Method and system for achieving semiconductor-based circuits or systems having multiple components with one or more matched or similar characteristics or features
US-10141227-B1 · Nov 27, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Nxp Usa Inc | 21 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/01 | 14 |
| H01L21/56 | 14 |
| H10W90/756 | 12 |
| H10W44/20 | 12 |
| H10W70/461 | 12 |