Molded air cavity packages and methods for the production thereof

Patent metadata

Field	Value
Publication number	US-10199302-B1
Application number	US-201715670429-A
Country	US
Kind code	B1
Filing date	Aug 7, 2017
Priority date	Aug 7, 2017
Publication date	Feb 5, 2019
Grant date	Feb 5, 2019

Abstract

Molded air cavity packages and methods for producing molded air cavity packages are disclosed. In one embodiment, the molded air cavity package includes a base flange, retention posts integrally formed with the base flange and extending from the flange frontside in a direction opposite the flange backside, and retention tabs having openings through which the retention posts are received. A molded package body is bonded to the base flange and envelopes, at least in substantial part, the retention posts and the retention tabs. The molded air cavity package further includes package leads extending from the molded package body. In certain implementations, the package leads and the retention tabs comprise singulated portions of a leadframe. Additionally or alternatively, the retention posts may be staked or otherwise physically deformed in a manner preventing disengagement of the retention posts from the retention tabs along a centerline of the molded air cavity package.

First claim

What is claimed is:

1. A molded air cavity package, comprising:
a base flange, comprising:
a flange frontside having a device mount area; and
a flange backside opposite the flange frontside, as taken along a centerline of the molded air cavity package;
retention posts integrally formed with the base flange and extending from the flange frontside in a direction opposite the flange backside;
retention tabs having openings through which the retention posts are received;
a molded package body bonded to the base flange and enveloping, at least in substantial part, the retention posts and the retention tabs; and
package leads extending from the molded package body.

2. The molded air cavity package of claim 1 wherein the package leads and the retention tabs comprise singulated portions of a leadframe.

3. The molded air cavity package of claim 1 wherein the retention posts extend substantially parallel to the centerline of the air cavity package; and
wherein the retentions posts comprise deformed terminal ends preventing disengagement of the retention posts from the retention tabs along the package centerline in a direction opposite the base flange.

4. The molded air cavity package of claim 3 wherein the deformed terminal ends comprise circumferentially-expanded staked heads of the retention posts.

5. The molded air cavity package of claim 1 wherein the retention tabs comprise singulated surfaces visible from an exterior of the molded package body.

6. The molded air cavity package of claim 1 further comprising punched depressions formed in the flange backside opposite the retention posts, as taken along the centerline of the molded air cavity package.

7. The molded air cavity package of claim 1 wherein the base flange further comprises a texturized surface region covered by and bonded to the molded package body.

8. The molded air cavity package of claim 7 wherein the texturized surface region is located adjacent junctures formed between the retention posts and the flange frontside.

9. The molded air cavity package of claim 1 further comprising:
a microelectronic device contained in the air cavity package and electrically interconnected with the package leads; and
a sintered metallic bond layer attaching the microelectronic device to the device mount area of the base flange.

10. The molded air cavity package of claim 9 wherein the sintered metallic bond layer is predominately composed of at least one of the group consisting of silver, gold, and copper, by weight.

11. The molded air cavity package of claim 1 wherein the package leads comprise proximal end portions bonded to the molded package body; and
wherein the molded package body comprises at least one lead isolation shelf located between the flange frontside and the proximal end portions of the plurality of leads, as taken along the centerline of the molded air cavity package.

12. The molded air cavity package of claim 11 wherein the molded package body further comprises an upper peripheral edge portion integrally formed with the lead insolation shelf, contacting the package leads, and bounding an outer periphery of an air cavity provided in the molded package body.

13. The molded air cavity package of claim 1 further comprising:
an air cavity;
a microelectronic device located in the air cavity, bonded to the base flange, and electrically interconnected with the package leads; and
a cover piece bonded to the molded package body to sealingly enclose the air cavity.

Assignees

• Nxp Usa Inc

Inventors

• Sanchez Audel
• Viswanathan Lakshminarayan
• Santos Fernando A
• Molla Jaynal A

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07341

  Controlling the bonding environment, e.g. atmosphere composition or temperature · CPC title

• H10W72/07331

  Connecting techniques · CPC title