Molded air cavity packages and methods for the production thereof

Patent metadata

Field	Value
Publication number	US-10529638-B2
Application number	US-201816211042-A
Country	US
Kind code	B2
Filing date	Dec 5, 2018
Priority date	Aug 7, 2017
Publication date	Jan 7, 2020
Grant date	Jan 7, 2020

Abstract

Molded air cavity packages and methods for producing molded air cavity packages are disclosed. In one embodiment, the molded air cavity package includes a molded package body having an upper peripheral edge portion, an air cavity around which the upper peripheral edge portion extends, and a cover piece bonded to the upper peripheral edge portion to enclose the air cavity. The cover piece has a lower peripheral edge portion, which cooperates with the upper peripheral edge portion to define a cover-body interface. The cover-body interface includes an annular channel extending around the cover-body interface, as taken about the package centerline, and first and second hardstop features formed on the upper peripheral edge portion of the molded package body and on the lower peripheral edge portion of the cover piece, respectively. The hardstop features contact to determine a vertical height of the annular channel, as taken along the package centerline.

First claim

What is claimed is:

1. A method for producing a molded air cavity package having a package centerline, the method comprising:
obtaining a molded package body having an upper peripheral edge portion, which bounds an outer periphery of an air cavity;
bonding a cover piece to the upper peripheral edge portion to sealingly enclose the air cavity, the cover piece having a lower peripheral edge portion cooperating with the upper peripheral edge portion to define a cover-body interface; and
selecting the molded package body and the cover piece such that the cover-body interface comprises:
an annular channel extending around the cover-body interface, as taken about the package centerline; and
first and second hardstop features formed on the upper peripheral edge portion of the molded package body and on the lower peripheral edge portion of the cover piece, respectively, the first and second hardstop features contacting to determine a vertical height of the annular channel, as taken along the package centerline.

2. The method of claim 1 further comprising selecting the molded package body such that the first hardstop feature comprises a raised annular rim, which extends around the upper peripheral edge portion of the molded package body.

3. The method of claim 2 further comprising selecting the molded package body to include an annular step feature formed adjacent the annular channel and having a height less than that of the raised annular rim, as taken along the package centerline.

4. The method of claim 2 further comprising selecting the cover piece such that the second hardstop feature comprises a flat surface region of the lower peripheral edge portion of the cover piece, the flat surface region principally extending in a plane orthogonal to the package centerline.

5. The method of claim 1 wherein bonding comprises utilizing bonding material to attach the cover piece to the molded package body, the bonding material applied in sufficient volume to substantially fill the annular channel.

6. The method of claim 1 wherein selecting comprises selecting the molded package body and the cover piece such that the cover-body interface further comprises:
a first angled contact surface formed on the lower peripheral edge portion of the cover piece; and
a second angled contact surface formed on the upper peripheral edge portion of the molded package body, the second angled contact surface contacting the first angled contact surface to center the cover piece over the molded package body.

7. The method of claim 6 wherein the first angled contact surface forms a first angle θ 1 with a horizontal plane orthogonal to the package centerline;
wherein the second angled contact surface forms a second angle θ 2 with a horizontal plane orthogonal to the package centerline; and
wherein θ 1 is greater than θ 2 .

8. The method of claim 6 wherein the first and second angled contact surfaces are located closer to the package centerline than are the hardstop features.

9. The method of claim 6 wherein the first and second angled contact surfaces are located closer to the package centerline than is the annular channel.

10. A method for producing molded air cavity package, comprising:
obtaining a molded package body having an upper peripheral edge portion, which extends around an outer periphery of an air cavity;
bonding a cover piece to the upper peripheral edge portion of the molded package body to sealingly enclose the air cavity, the cover piece having a lower peripheral edge portion cooperating with the upper peripheral edge portion to define a cover-body interface; and
selecting the molded package body and the cover piece such that the cover-body interface comprises:
a first angled contact surface formed on the lower peripheral edge portion of the cover piece; and
a second angled contact surface formed on the upper peripheral edge portion of the molded package body and contacting the first angled contact surface to center the cover piece over the molded package body.

11. The method of claim 10 wherein bonding comprises applying bonding material into a channel further included in the cover-body interface, the first and second angled contact surfaces located inboard of the channel.

12. The method of claim 10 wherein the molded package body is formed around a base flange having a frontside and a knurled surface region; and
wherein the method further comprises, prior to bonding the cover piece to the upper peripheral portion of molded package body, attaching a microelectronic device to the frontside of the base flange at a location around which the knurled surface region extends.

13. A method for producing a molded air cavity package, comprising:
placing a base flange in a desired spatial relationship with respect to package leads contained in a leadframe;
forming a molded package body around selected regions of the base flange and the leadframe, the molded package body comprising an upper peripheral edge portion contacting the package leads and peripherally bounding an air cavity; and
when forming the molded package body, imparting the upper peripheral edge with an annular channel extending around the air cavity, as taken about a centerline of the air cavity package.

14. The method of claim 13 further comprising attaching the cover piece to the molded package body utilizing a bonding material applied at an interface between the upper peripheral edge portion of the molded package body and a lower peripheral edge portion of the cover piece.

15. The method of claim 14 wherein the annular channel has a fixed volumetric capacity, as measured when a cover piece is positioned over and contacts a hardstop feature provided on the upper peripheral edge portion of the molded package body; and
wherein the bonding material is applied in a predetermined volume exceeding the fixed volumetric capacity, while being less than a cumulative void space between the lower peripheral edge portion of the cover piece and the upper peripheral edge portion of the molded package body.

16. The method of claim 13 wherein the base flange comprises a flange frontside having a knurled surface region thereon, and wherein forming comprises forming the molded package body to cover at least a majority of the knurled surface region by area.

17. The method of claim 13 wherein the molded package body is formed to comprise a first hardstop feature, which extends around the upper peripheral edge portion of the molded package body.

18. The method of claim 17 further comprising:
attaching a cover piece to the molded package body to enclose the air cavity; and
when attaching the cover piece to the molded package body, positioning the cover piece with respect to the molded package body such that the first hardstop feature contacts a second hardstop feature formed on a lower peripheral edge portion of the cover piece.

19. The method of claim 17 wherein the molded package body is formed to further comprise a step feature having a height less than that of the first hardstop feature, as taken along the centerline of the air cavity package.

20. The method of claim 17 wherein the molded package body is formed to further comprise a first angled contact surface inboard of the first hardstop feature.

Assignees

• Nxp Usa Inc

Inventors

• Sanchez Audel
• Viswanathan Lakshminarayan
• Santos Fernando A
• Molla Jaynal A

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07341

  Controlling the bonding environment, e.g. atmosphere composition or temperature · CPC title

• H10W72/07331

  Connecting techniques · CPC title