Flexible and modular top and bottom side processor unit module cooling
US-12504799-B2 · Dec 23, 2025 · US
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Sahu Bijoyraj patents
Sahu Bijoyraj is listed as an inventor on 20 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sahu Bijoyraj |
| Total patents | 20 |
| First publication | Jan 13, 2015 |
| Latest publication | Dec 23, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Liquid metal interconnect for modular system on an interposer server architecture
US-12494435-B2 · Dec 9, 2025 · US
Liquid cooling system leak detection improvements
US-12442712-B2 · Oct 14, 2025 · US
Variable conductance heat pipes for improved reliability
US-12345474-B2 · Jul 1, 2025 · US
Flexible and modular top and bottom side processor unit module cooling
US-2024345639-A1 · Oct 17, 2024 · US
Flexible and modular top and bottom side processor unit module cooling
US-12055986-B2 · Aug 6, 2024 · US
Liquid metal interconnect for modular system on an interposer server architecture
US-2023197622-A1 · Jun 22, 2023 · US
Microelectronic assemblies having dies with backside back-end-of-line heater traces
US-2022415742-A1 · Dec 29, 2022 · US
Scalable debris-free socket loading mechanism
US-11387163-B2 · Jul 12, 2022 · US
Liquid cooling system leak detection improvements
US-2022196507-A1 · Jun 23, 2022 · US
Recent patents
Latest publications not already listed above.
Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets
US-11291115-B2 · Mar 29, 2022 · US
Flexible and modular top and bottom side processor unit module cooling
US-2021208647-A1 · Jul 8, 2021 · US
Modular thermal energy management designs for data center computing
US-11032941-B2 · Jun 8, 2021 · US
Scalable debris-free socket loading mechanism
US-2019304869-A1 · Oct 3, 2019 · US
Mechanical seal and reservoir for microelectronic packages
US-10418309-B1 · Sep 17, 2019 · US
Modular thermal energy management designs for data center computing
US-2019223324-A1 · Jul 18, 2019 · US
Printhead with nanotips for nanoscale printing and manufacturing
US-9889653-B2 · Feb 13, 2018 · US
Printhead with nanotips for nanoscale printing and manufacturing
US-2015217568-A1 · Aug 6, 2015 · US
Printhead with nanotips for nanoscale printing and manufacturing
US-9038269-B2 · May 26, 2015 · US
Laser transmission laminating of materials for ink jet printheads
US-8931879-B2 · Jan 13, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 16 |
| Xerox Corp | 4 |
| Nystrom Peter J | 1 |
| Cellura Mark A | 1 |
| Sahu Bijoyraj | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K7/20772 | 8 |
| H05K7/20254 | 6 |
| H05K1/0272 | 4 |
| G06F2200/201 | 4 |
| H05K7/20809 | 4 |