Variable conductance heat pipes for improved reliability

Patent metadata

Field	Value
Publication number	US-12345474-B2
Application number	US-202017130906-A
Country	US
Kind code	B2
Filing date	Dec 22, 2020
Priority date	Dec 22, 2020
Publication date	Jul 1, 2025
Grant date	Jul 1, 2025

Abstract

A variable conductance heat pipe (VCHP) is utilized as a “passive heat switch” to regulate a characteristic temperature of an integrated circuit component. The VCHP is located between an integrated circuit component and a cold plate and comprises a working fluid and a non-condensable gas in a chamber. When the component is not operational, the VCHP blocks the flow of heat from the component to the cold plate. As component power consumption increases, the working fluid pressure increases and compresses the non-condensable gas toward the cooler region of the cold plate to eventually create a low thermal resistance path between the component and the cold plate. By introducing negative feedback into the thermal management solution, the VCHP keeps the characteristic temperature within a narrow range. This can alleviate stress on package components (e.g., solder joints) due to excessive thermal cycling, which can extend the lifetime of the component.

First claim

We claim:

1. A method comprising:
operating a first processor unit of a plurality of processor units of an integrated circuit component at a first power level, the plurality of processor units located in an integrated circuit component; and
operating the first processor unit at a second power level, the first power level lesser than the second power level, the integrated circuit component physically coupled to a variable conductance heat pipe (VCHP), the VCHP comprising a first exterior surface and a second exterior surface, the first exterior surface and the second exterior surface being substantially parallel to each other and located opposite from each other, the VCHP located between the integrated circuit component and a cold plate, the VCHP directly attached to the cold plate at the first exterior surface, the direct attachment of the VCHP to the cold plate associated with a first area, the VCHP physically coupled to the integrated circuit component at the second exterior surface, the physical coupling of the VCHP to the integrated circuit component associated with a second area that at least partially overlaps the first area, the VCHP to allow a first rate of heat transfer between the integrated circuit component and the cold plate when the first processor unit is operated at the first power level and a second rate of heat transfer between the integrated circuit component and the cold plate when the first processor unit is operated at the second power level, the first rate of heat transfer less than the second rate of heat transfer.

2. The method of claim 1 , further comprising pumping a cooling liquid through the cold plate.

3. The method of claim 1 , wherein the integrated circuit component comprises one or more instances of the first processor unit and one or more instances of a second processor unit, the first processor unit different from the second processor unit.

4. The method of claim 1 , wherein one or more conduits carry a cooling liquid, the one or more conduits arranged to create a loop comprising a heat exchanger, a pump, and the cold plate.

5. An apparatus comprising:
an integrated circuit component comprising one or more integrated circuits;
a cold plate; and
a variable conductance heat pipe (VCHP) comprising a first exterior surface and a second exterior surface, the first exterior surface and the second exterior surface being substantially parallel to each other and located opposite from each other, the VCHP directly attached to the cold plate at the first exterior surface, the direct attachment of the VCHP to the cold plate associated with a first area, the VCHP physically coupled to the integrated circuit component at the second exterior surface, the physical coupling of the VCHP to the integrated circuit component associated with a second area that at least partially overlaps the first area.

6. The apparatus of claim 5 , wherein the one or more integrated circuits comprise one or more instances of a first integrated circuit and one or more instances of a second integrated circuit, the first integrated circuit different from the second integrated circuit.

7. The apparatus of claim 5 , wherein the integrated circuit component comprises a package containing the one or more integrated circuits.

8. The apparatus of claim 5 , further comprising a printed circuit board, the integrated circuit component physically coupled to the printed circuit board.

9. The apparatus of claim 5 , wherein the first area completely overlaps the second area.

10. The apparatus of claim 5 , wherein the VCHP has a length, a width, and a height, the integrated circuit component spaced from the cold plate in a direction of the height of the VCHP, the height of the VCHP being less than the length of the VCHP and less than the width of the VCHP.

11. The apparatus of claim 5 , wherein the cold plate comprises a fluid inlet and a fluid outlet, the first area at least partially overlapping a line segment extending from the fluid inlet to the fluid outlet.

12. The apparatus of claim 5 , wherein the one or more integrated circuits comprise one or more processing units.

13. The apparatus of claim 5 , wherein the integrated circuit component further comprises an integrated heat spreader located adjacent to the VCHP.

14. The apparatus of claim 5 , further comprising:
a heat exchanger;
a pump; and
one or more conduits to carry a cooling liquid, the one or more conduits arranged to create a loop comprising the heat exchanger and the cold plate.

15. The apparatus of claim 14 , further comprising a housing containing the integrated circuit component, the cold plate, the VCHP, the heat exchanger, and the pump.

Assignees

• Intel Corp

Inventors

• Kulkarni Devdatta Prakash
• Sahu Bijoyraj

Classifications

• F28D15/0233 Primary

  the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence) · CPC title

• F28D15/0275

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• F28F23/00

  Features relating to the use of intermediate heat-exchange materials, e.g. selection of compositions (heat-transfer, heat-exchange or heat-storage materials C09K5/00) · CPC title

• F28F2013/008

  Variable conductance materials; Thermal switches · CPC title

• F28D2021/0029

  Heat sinks · CPC title