Flexible and modular top and bottom side processor unit module cooling

Patent metadata

Field	Value
Publication number	US-12504799-B2
Application number	US-202418755226-A
Country	US
Kind code	B2
Filing date	Jun 26, 2024
Priority date	Feb 26, 2021
Publication date	Dec 23, 2025
Grant date	Dec 23, 2025

Abstract

Flexible and modular top and bottom side processor unit module cooling is disclosed. An example apparatus comprises a printed circuit board including an integrated circuit component on a first side of the printed circuit board, and an electronic component on a second side of the printed circuit board, the second side facing away from the first side; a stiffener to at least partially enclose the printed circuit board, and a flexible strap to thermally couple the electronic component and a portion of the stiffener, the portion of the stiffener positioned adjacent the first side of the printed circuit board.

First claim

The invention claimed is:

1 . An apparatus comprising:
a printed circuit board including: an integrated circuit component on a first side of the printed circuit board; and an electronic component on a second side of the printed circuit board, the second side facing away from the first side; a stiffener to at least partially enclose the printed circuit board; a flexible strap to thermally couple the electronic component and a portion of the stiffener, the portion of the stiffener positioned adjacent the first side of the printed circuit board; and a slug, the slug in contact with the stiffener and the flexible thermal strap.

2 . The apparatus of claim 1 , wherein the flexible strap includes at least one of copper or graphite.

3 . The apparatus of claim 1 , wherein the slug separates the flexible strap from the second side of the printed circuit board.

4 . The apparatus of claim 1 , wherein the electronic component is included in an array of electronic components on the second side of the printed circuit board.

5 . The apparatus of claim 4 , wherein the array of electronic components on the second side of the printed circuit board is aligned with the integrated circuit component on the first side of the printed circuit board.

6 . An apparatus comprising:
a printed circuit board including: an integrated circuit component on a first side of the printed circuit board; and an electronic component on a second side of the printed circuit board, the second side facing away from the first side; a stiffener to at least partially enclose the printed circuit board, the stiffener including:
a plate adjacent to the first side of the printed circuit board; and
a frame adjacent to the second side of the printed circuit board, the frame attached to the plate; and
a flexible strap to thermally couple the electronic component and a portion of the stiffener, the portion of the stiffener positioned adjacent the first side of the printed circuit board.

7 . The apparatus of claim 6 , wherein the plate includes an opening, the opening to receive the integrated circuit component.

8 . A computing system comprising:
a baseboard; a printed circuit board coupled to the baseboard, the printed circuit board including an integrated circuit package on a first side of the printed circuit board, the first side opposite a second side of the printed circuit board; a plate adjacent to the first side of the printed circuit board; and a slug adjacent to the second side of the printed circuit board, the slug thermally coupled to the plate along a path extending around an edge of the printed circuit board.

9 . The computing system of claim 8 , further includes a plurality of thermally conductive cables to extend between the slug and the plate, the plurality of thermally conductive cables defining the path.

10 . The computing system of claim 8 , wherein the plate is a first plate, further including a second plate fastened to the first plate, the second plate adjacent to the second side of the printed circuit board, the slug positioned between the second plate and the second side of the printed circuit board.

11 . The computing system of claim 8 , wherein the printed circuit board further includes an electronic component on the second side of the printed circuit board.

12 . The computing system of claim 11 , wherein the electronic component is a voltage regulator.

13 . The computing system of claim 11 , wherein the electronic component is thermally coupled to the plate via the slug.

14 . The computing system of claim 11 , wherein the electronic component is a first electronic component, the edge of the printed circuit board is a first edge, and the printed circuit board further includes a second electronic component on the second side, the first electronic component adjacent the first edge and the second electronic component adjacent a second edge of the printed circuit board, the second edge opposite the first edge.

15 . An apparatus comprising:
a slug; a plate; a printed circuit board having opposing first and second sides, the first side to face the plate, the second side to face the slug; and
a conductive cable to extend around an edge of the printed circuit board to thermally couple the plate to the slug.

16 . The apparatus of claim 15 , wherein the plate is in contact with the first side of the printed circuit board.

17 . The apparatus of claim 16 , further including an integrated circuit component on the first side, the plate adjacent to the integrated circuit component.

18 . The apparatus of claim 15 , wherein the edge of the printed circuit board includes a first segment adjacent to a second segment, the first segment inset relative to a second segment, the conductive cable to extend around the first segment.

19 . The apparatus of claim 18 , wherein the conductive cable is a first conductive cable and the edge is a first edge, the apparatus further including a second conductive cable thermally coupled to the plate, the second conductive cable to extend around a second edge of the printed circuit board, the second edge opposite the first edge.

Assignees

• Intel Corp

Inventors

• Macias Andres Ramirez
• Athalye Aardra B
• Kulkarni Devdatta Prakash
• Paredes Gilberto Rayas
• Sahu Bijoyraj

Classifications

• H05K1/0272

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• G06F2200/201

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• H05K7/20809

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• H05K7/20772

  within server blades for removing heat from heat source · CPC title

• H05K7/20336

  Heat pipes, e.g. wicks or capillary pumps · CPC title