Separation of integrated circuit structure from adjacent chip
US-10256204-B2 · Apr 9, 2019 · US
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Richard Glen E patents
Richard Glen E is listed as an inventor on 23 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Richard Glen E |
| Total patents | 23 |
| First publication | Apr 2, 2015 |
| Latest publication | Apr 9, 2019 |
Notable patents
Publications ranked by popularity score, then publication date.
Chip joining by induction heating
US-10245667-B2 · Apr 2, 2019 · US
Method for semiconductor die removal rework
US-10050012-B2 · Aug 14, 2018 · US
Separation of integrated circuit structure from adjacent chip
US-2018130733-A1 · May 10, 2018 · US
Chip joining by induction heating
US-2017312841-A1 · Nov 2, 2017 · US
Chip joining by induction heating
US-9776270-B2 · Oct 3, 2017 · US
Visually detecting electrostatic discharge events
US-9711422-B2 · Jul 18, 2017 · US
Semiconductor structure and method of making
US-2017200699-A1 · Jul 13, 2017 · US
Semiconductor structure and method of making
US-9704830-B1 · Jul 11, 2017 · US
Method and structure for semiconductor die removal rework
US-2017148762-A1 · May 25, 2017 · US
Recent patents
Latest publications not already listed above.
Reliability monitor test strategy definition
US-9645573-B2 · May 9, 2017 · US
Induction heating for underfill removal and chip rework
US-2016372444-A1 · Dec 22, 2016 · US
Induction heating for underfill removal and chip rework
US-9508680-B1 · Nov 29, 2016 · US
IC structure with recessed solder bump area and methods of forming same
US-9472490-B1 · Oct 18, 2016 · US
Reliability monitor test strategy definition
US-2016147220-A1 · May 26, 2016 · US
Visually detecting electrostatic discharge events
US-2015355253-A1 · Dec 10, 2015 · US
Solder bump reflow by induction heating
US-9190375-B2 · Nov 17, 2015 · US
Reducing thermal energy transfer during chip-join processing
US-9177931-B2 · Nov 3, 2015 · US
Solder bump reflow by induction heating
US-2015294948-A1 · Oct 15, 2015 · US
Reducing thermal energy transfer during chip-join processing
US-2015243618-A1 · Aug 27, 2015 · US
Visually detecting electrostatic discharge events
US-9105573-B2 · Aug 11, 2015 · US
Inhibiting propagation of imperfections in semiconductor devices
US-9059097-B2 · Jun 16, 2015 · US
Chip joining by induction heating
US-2015089805-A1 · Apr 2, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 13 |
| Globalfoundries Inc | 8 |
| Globalfoundries Inc | 4 |
| Ayotte Stephen P | 2 |
| Hill David J | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 9 |
| H10W72/072 | 8 |
| H10W72/923 | 7 |
| H10W72/252 | 7 |
| H10W72/29 | 7 |