Chip joining by induction heating

Patent metadata

Field	Value
Publication number	US-10245667-B2
Application number	US-201715654130-A
Country	US
Kind code	B2
Filing date	Jul 19, 2017
Priority date	Oct 1, 2013
Publication date	Apr 2, 2019
Grant date	Apr 2, 2019

Abstract

Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.

First claim

What is claimed is:

1. An apparatus for joining a chip with a substrate, the apparatus comprising:
a pick-and-place machine including a pick-up head to for releasably holding the chip and a robotic arm for moving the pick-up head in a motion path;
an induction heater including a plurality of coil turns located in the motion path directly over the substrate, the coil turns having an inner diameter defining an interior surface; and
a power supply coupled with the induction heater, the power supply configured to supply electrical power with a time-varying alternating current to the coil turns of the induction heater for heating solder bumps on the chip by electromagnetic induction while the chip is releasably held by the pick-up head, wherein the pick-up head moves the chip axially through the interior surface of the coil turns and toward the substrate.

2. The apparatus of claim 1 wherein the pick-and-place machine continuously moves the pick-up head in the motion path toward the substrate as the induction heater heats the solder bumps.

3. The apparatus of claim 1 further comprising: a controller coupled with the power supply, the controller including at least one processor and a memory including program code that, when executed by the at least one processor, causes the power supply to supply the electrical power with the time-varying alternating current to the coil turns of the induction heater.

4. The apparatus of claim 3 wherein the controller is coupled with the pick-and-place machine, and the program code, when executed by the at least one processor, cause the robotic arm to move the pick-up head in the motion path in which the chip is moved axially through the interior surface of the coil turns.

5. The apparatus of claim 4 further comprising: a conveyor, wherein the controller is coupled with the conveyor, and the program code, when executed by the at least one processor, cause the conveyor to move the substrate to a location at which the coils turns are directly over the substrate.

6. The apparatus of claim 1 further comprising:
a conveyor for moving the substrate into a location proximate to the induction heater.

7. The apparatus of claim 1 wherein the robotic arm is a programmable mechanical arm with a plurality of joints and a plurality of links connected by the joints that allow rotational motion and/or translational displacement of the pick-up head.

8. The apparatus of claim 1 wherein the induction heater has a fixed position in relation to the substrate as the pick-up head moves in the motion path.

Assignees

• Globalfoundries Inc

Inventors

• Ayotte Stephen P
• Richard Glen E
• Sullivan Timothy D
• Sullivan Timothy M

Classifications

• H05K3/3436

  having an array of bottom contacts, e.g. pad grid array or ball grid array components · CPC title

• H05K2203/101

  Using electrical induction, e.g. for heating during soldering · CPC title

• H05K3/3494

  Heating processes for reflow soldering · CPC title

• Y10T29/53178

  Chip component · CPC title

• Y10T29/49144

  by metal fusion · CPC title