Method and system for die to wafer bonding
US-2026099099-A1 · Apr 9, 2026 · US
Power David is listed as an inventor on 61 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Power David |
| Total patents | 61 |
| First publication | Mar 5, 2015 |
| Latest publication | Apr 9, 2026 |
Publications ranked by popularity score, then publication date.
US-2026099099-A1 · Apr 9, 2026 · US
US-2026068690-A1 · Mar 5, 2026 · US
US-12564027-B2 · Feb 24, 2026 · US
US-12512356-B2 · Dec 30, 2025 · US
US-2025308949-A1 · Oct 2, 2025 · US
US-2025308951-A1 · Oct 2, 2025 · US
US-2025306463-A1 · Oct 2, 2025 · US
US-2025300010-A1 · Sep 25, 2025 · US
US-2025259943-A1 · Aug 14, 2025 · US
US-2025189901-A1 · Jun 12, 2025 · US
Latest publications not already listed above.
US-2025191970-A1 · Jun 12, 2025 · US
US-2024289529-A1 · Aug 29, 2024 · US
US-2024203778-A1 · Jun 20, 2024 · US
US-2023352343-A1 · Nov 2, 2023 · US
US-2023290676-A1 · Sep 14, 2023 · US
US-2023187420-A1 · Jun 15, 2023 · US
US-11600605-B2 · Mar 7, 2023 · US
US-2021159220-A1 · May 27, 2021 · US
US-10950584-B2 · Mar 16, 2021 · US
US-10813197-B2 · Oct 20, 2020 · US
US-10736936-B2 · Aug 11, 2020 · US
US-2020126956-A1 · Apr 23, 2020 · US
US-10595380-B2 · Mar 17, 2020 · US
US-10546843-B2 · Jan 28, 2020 · US
US-2019139943-A1 · May 9, 2019 · US
US-10172215-B2 · Jan 1, 2019 · US
US-2018295705-A1 · Oct 11, 2018 · US
US-D825789-S · Aug 14, 2018 · US
US-9995441-B2 · Jun 12, 2018 · US
US-9967944-B2 · May 8, 2018 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Cree Inc | 34 |
| Tokyo Electron Ltd | 15 |
| Ideal Ind Lighting Llc | 8 |
| Allergan Inc | 3 |
| Globalfoundries Inc | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| F21Y2115/10 | 27 |
| F21K9/232 | 17 |
| F21Y2103/10 | 13 |
| F21Y2113/17 | 9 |
| H05B47/19 | 8 |