Method of forming a semiconductor device including an absorption layer
US-12550645-B2 · Feb 10, 2026 · US
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Piccin Matteo patents
Piccin Matteo is listed as an inventor on 20 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Piccin Matteo |
| Total patents | 20 |
| First publication | Jan 9, 2020 |
| Latest publication | Feb 10, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of processing a semiconductor wafer
US-2025183031-A1 · Jun 5, 2025 · US
Manufacturing and reuse of semiconductor substrates
US-12249504-B2 · Mar 11, 2025 · US
Composite substrate including a transfer foil with porous silicon carbide layer, power semiconductor device and method of manufacturing
US-2025022707-A1 · Jan 16, 2025 · US
Method of manufacturing a semiconductor device having frame structures laterally surrounding backside metal structures
US-11990520-B2 · May 21, 2024 · US
Method of manufacturing a semiconductor device
US-2024006218-A1 · Jan 4, 2024 · US
Semiconductor wafer, clip and semiconductor device
US-2023411336-A1 · Dec 21, 2023 · US
Method for processing a semiconductor wafer, semiconductor wafer, clip and semiconductor device
US-11756917-B2 · Sep 12, 2023 · US
Manufacturing and reuse of semiconductor substrates
US-2023127556-A1 · Apr 27, 2023 · US
Method of Forming a Semiconductor Device Including an Absorption Layer
US-2023092013-A1 · Mar 23, 2023 · US
Recent patents
Latest publications not already listed above.
Carrier, laminate and method of manufacturing semiconductor devices
US-11576259-B2 · Feb 7, 2023 · US
Method of manufacturing a silicon carbide device and wafer composite including laser modified zones in a handle substrate
US-11373863-B2 · Jun 28, 2022 · US
Method of manufacturing a semiconductor device having frame structures laterally surrounding backside metal structures
US-2022085174-A1 · Mar 17, 2022 · US
Semiconductor device and method of manufacturing a semiconductor device
US-11211459-B2 · Dec 28, 2021 · US
Semiconductor device and method of manufacturing a semiconductor device
US-11139375-B2 · Oct 5, 2021 · US
Method for processing a semiconductor wafer, semiconductor wafer, clip and semiconductor device
US-2021305198-A1 · Sep 30, 2021 · US
Method of Manufacturing a Silicon Carbide Device and Wafer Composite Including Laser Modified Zones in a Handle Substrate
US-2020357637-A1 · Nov 12, 2020 · US
Semiconductor Device and Method of Manufacturing a Semiconductor Device
US-2020194558-A1 · Jun 18, 2020 · US
Carrier, laminate and method of manufacturing semiconductor devices
US-2020068709-A1 · Feb 27, 2020 · US
Semiconductor device and method of manufacturing a semiconductor device
US-2020013859-A1 · Jan 9, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 17 |
| Infineon Technologies Austria Ag | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D62/8325 | 16 |
| H10P72/74 | 12 |
| H01L29/1608 | 10 |
| H10W90/736 | 10 |
| H10P72/7416 | 9 |