Integrated circuit (IC) package substrate with embedded trace substrate (ETS) layer on a substrate, and related fabrication methods
US-12354935-B2 · Jul 8, 2025 · US
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Park Joonsuk patents
Park Joonsuk is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Park Joonsuk |
| Total patents | 8 |
| First publication | Sep 3, 2015 |
| Latest publication | Jul 8, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Multi-dielectric structure in two-layer embedded trace substrate
US-11342254-B2 · May 24, 2022 · US
Integrated circuit (ic) package substrate with embedded trace substrate (ets) layer on a substrate, and related fabrication methods
US-2022068780-A1 · Mar 3, 2022 · US
Multi-dielectric structure in two-layer embedded trace substrate
US-2021287976-A1 · Sep 16, 2021 · US
Array type inductor
US-10403707-B2 · Sep 3, 2019 · US
Array type inductor
US-2018286562-A1 · Oct 4, 2018 · US
Functionalized graphene-Pt composites for fuel cells and photoelectrochemical cells
US-9748581-B2 · Aug 29, 2017 · US
Functionalized Graphene-Pt composites for fuel cells and photoelectrochemical cells
US-2015247258-A1 · Sep 3, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Qualcomm Inc | 6 |
| Univ Leland Stanford Junior | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/05 | 4 |
| H10W70/685 | 4 |
| H01L21/4857 | 4 |
| H01L23/49822 | 4 |
| H10W70/635 | 4 |