Electronic package module and method for fabrication of the same
US-2024413067-A1 · Dec 12, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L21/4857 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 5,891 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 82 |
| 2016 | 198 |
| 2017 | 303 |
| 2018 | 407 |
| 2019 | 563 |
| 2020 | 684 |
| 2021 | 659 |
| 2022 | 700 |
| 2023 | 730 |
| 2024 | 744 |
| 2025 | 714 |
| 2026 | 107 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor devices and methods of manufacturing
US-12166025-B2 · Dec 10, 2024 · US
Method of forming semiconductor devices
US-2024387980-A1 · Nov 21, 2024 · US
Package formation methods including coupling a molded routing layer to an integrated routing layer
US-2024355697-A1 · Oct 24, 2024 · US
Package substrate having porous dielectric layer
US-2024282693-A1 · Aug 22, 2024 · US
Semiconductor substrate and manufacturing method thereof
US-2024274520-A1 · Aug 15, 2024 · US
Electronic package and manufacturing method thereof
US-2024274519-A1 · Aug 15, 2024 · US
Integrated fan-out package and manufacturing method thereof
US-2024178120-A1 · May 30, 2024 · US
Chuck, lamination process, and manufacturing method of semiconductor package using the same
US-11993066-B2 · May 28, 2024 · US
Dual sided embedded passives via panel level thermal compression bonding
US-2024113000-A1 · Apr 4, 2024 · US
Semiconductor structure and manufacturing method thereof
US-2024063101-A1 · Feb 22, 2024 · US
MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTROMAGNETIC ISOLATION (EMI) SHIELD STRUCTURES AND RELATED METHODS
US-2024021538-A1 · Jan 18, 2024 · US
Semiconductor device and method of manufacturing semiconductor device
US-2015380347-A1 · Dec 31, 2015 · US
Multilayer ceramic electronic device and method for manufacturing the same
US-9226400-B2 · Dec 29, 2015 · US
Embedded chip packaging technology
US-2015371935-A1 · Dec 24, 2015 · US
Method of Forming Package-On-Package (PoP) Structure
US-2015357320-A1 · Dec 10, 2015 · US
Method of making integrated circuit
US-2015357238-A1 · Dec 10, 2015 · US
Wiring substrate, semiconductor device, and method for manufacturing wiring substrate
US-2015357276-A1 · Dec 10, 2015 · US
Methods of providing dielectric to conductor adhesion in package structures
US-2015357185-A1 · Dec 10, 2015 · US
Wiring substrate and method of manufacturing the same
US-9210808-B2 · Dec 8, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L21/4857?
- CPC H01L21/4857 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L21/4857 (Electricity)?
- Our database includes 5,891 publications tagged with this CPC code.
- Is patent activity under CPC H01L21/4857 growing?
- Publication counts under this code: 744 in 2024 vs 714 in 2025 (latest complete years).