Semiconductor packages having a dam structure
US-12261093-B2 · Mar 25, 2025 · US
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Park Hwanpil patents
Park Hwanpil is listed as an inventor on 19 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Park Hwanpil |
| Total patents | 19 |
| First publication | Aug 23, 2018 |
| Latest publication | Mar 25, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor package structure and fabrication method thereof
US-12136581-B2 · Nov 5, 2024 · US
Semiconductor package
US-2024321701-A1 · Sep 26, 2024 · US
Semiconductor package
US-12033924-B2 · Jul 9, 2024 · US
Semiconductor package structure and fabrication method thereof
US-2024079288-A1 · Mar 7, 2024 · US
Semiconductor package structure and fabrication method thereof
US-11842941-B2 · Dec 12, 2023 · US
Semiconductor package and a package-on-package including the same
US-11776913-B2 · Oct 3, 2023 · US
Semiconductor package
US-2023114274-A1 · Apr 13, 2023 · US
Semiconductor packages having a package substrate and method for manufacturing the same
US-2023110126-A1 · Apr 13, 2023 · US
Semiconductor package
US-2022384320-A1 · Dec 1, 2022 · US
Recent patents
Latest publications not already listed above.
Semiconductor packages having a dam structure
US-2022384291-A1 · Dec 1, 2022 · US
Semiconductor packages having a dam structure
US-11437293-B2 · Sep 6, 2022 · US
Semiconductor package structure and fabrication method thereof
US-2022216121-A1 · Jul 7, 2022 · US
Semiconductor package structure and fabrication method thereof
US-11315851-B2 · Apr 26, 2022 · US
Semiconductor package and a package-on-package including the same
US-2021407911-A1 · Dec 30, 2021 · US
Semiconductor packages having a dam structure
US-2021242101-A1 · Aug 5, 2021 · US
Semiconductor package structure and fabrication method thereof
US-2021082783-A1 · Mar 18, 2021 · US
Semiconductor package structure and fabrication method thereof
US-10847435-B2 · Nov 24, 2020 · US
Semiconductor package structure and fabrication method thereof
US-2018240729-A1 · Aug 23, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 19 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 19 |
| H10W90/724 | 19 |
| H10W90/701 | 19 |
| H10W72/072 | 16 |
| H10W72/20 | 16 |