Thin film wafer transfer and structure for electronic devices
US-10957816-B2 · Mar 23, 2021 · US
Park Hongsik is listed as an inventor on 21 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Park Hongsik |
| Total patents | 21 |
| First publication | May 19, 2015 |
| Latest publication | Mar 23, 2021 |
Publications ranked by popularity score, then publication date.
US-10957816-B2 · Mar 23, 2021 · US
US-9884827-B2 · Feb 6, 2018 · US
US-9691847-B2 · Jun 27, 2017 · US
US-9666674-B2 · May 30, 2017 · US
US-9643926-B2 · May 9, 2017 · US
US-9394178-B2 · Jul 19, 2016 · US
US-2016204196-A1 · Jul 14, 2016 · US
US-2016137605-A1 · May 19, 2016 · US
US-2016141501-A1 · May 19, 2016 · US
US-9337274-B2 · May 10, 2016 · US
Latest publications not already listed above.
US-9324794-B2 · Apr 26, 2016 · US
US-9312132-B2 · Apr 12, 2016 · US
US-9273004-B2 · Mar 1, 2016 · US
US-2015336800-A1 · Nov 26, 2015 · US
US-2015263087-A1 · Sep 17, 2015 · US
US-2015235849-A1 · Aug 20, 2015 · US
US-2015228728-A1 · Aug 13, 2015 · US
US-9096050-B2 · Aug 4, 2015 · US
US-9093290-B2 · Jul 28, 2015 · US
US-9059013-B2 · Jun 16, 2015 · US
US-9035282-B2 · May 19, 2015 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 19 |
| Globalfoundries Inc | 2 |
| Afzali-Ardakani Ali | 1 |
| Park Hongsik | 1 |
| Tulevski George Stojan | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D62/882 | 15 |
| B82Y40/00 | 13 |
| B82Y10/00 | 13 |
| H10P14/3406 | 12 |
| H01L29/1606 | 12 |