Semiconductor device
US-12575149-B2 · Mar 10, 2026 · US
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Ozaki Daisuke patents
Ozaki Daisuke is listed as an inventor on 44 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ozaki Daisuke |
| Total patents | 44 |
| First publication | Mar 3, 2016 |
| Latest publication | Mar 10, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor device and manufacturing method
US-12527016-B2 · Jan 13, 2026 · US
Semiconductor device
US-12520570-B2 · Jan 6, 2026 · US
Semiconductor device having an injection suppression region
US-12471303-B2 · Nov 11, 2025 · US
Ink discharging device, method of discharging ink, method of manufacturing ink-discharged matter, white ink, and set
US-12286542-B2 · Apr 29, 2025 · US
Set of inkjet inks, inkjet image forming method, and inkjet image forming apparatus
US-12221549-B2 · Feb 11, 2025 · US
Resin-metal composite body and method of manufacturing resin-metal composite body
US-2025003104-A1 · Jan 2, 2025 · US
Semiconductor device
US-12183789-B2 · Dec 31, 2024 · US
Semiconductor device
US-2024120412-A1 · Apr 11, 2024 · US
Semiconductor device and method for manufacturing semiconductor device
US-2024006519-A1 · Jan 4, 2024 · US
Recent patents
Latest publications not already listed above.
Insulated gate bipolar transistor
US-2023395706-A1 · Dec 7, 2023 · US
Ink discharging device, method of discharging ink, method of manufacturing ink-discharged matter, white ink, and set
US-2023303869-A1 · Sep 28, 2023 · US
Ink, ink set, set of ink and pre-processing fluid, method of discharging ink, and ink discharging device
US-2023303872-A1 · Sep 28, 2023 · US
Semiconductor device and manufacturing method
US-2023261097-A1 · Aug 17, 2023 · US
Semiconductor device
US-2023260991-A1 · Aug 17, 2023 · US
Set of inkjet inks, inkjet image forming method, and inkjet image forming apparatus
US-2023132661-A1 · May 4, 2023 · US
Ink set, image forming method, and image forming apparatus
US-2023120554-A1 · Apr 20, 2023 · US
Semiconductor device
US-2023124922-A1 · Apr 20, 2023 · US
Laminated body and method for producing the same, curable liquid composition set, inkjet printing apparatus, and inkjet printing method
US-11498351-B2 · Nov 15, 2022 · US
Ink set, image forming method, and image forming apparatus
US-2022298373-A1 · Sep 22, 2022 · US
Processing fluid, set of processing fluid and ink, applying device, image forming device, applying method, and image forming method
US-2022289993-A1 · Sep 15, 2022 · US
Processing fluid, set of processing fluid and ink, applying device, image forming device, applying method, and image forming method
US-2022282107-A1 · Sep 8, 2022 · US
Semiconductor device
US-2022149191-A1 · May 12, 2022 · US
Semiconductor device
US-2022123108-A1 · Apr 21, 2022 · US
Semiconductor device for improving transistor characteristics during turn-on
US-11264491-B2 · Mar 1, 2022 · US
Method of manufacturing printed matter, printed matter, and device for manufacturing printed matter
US-11198313-B2 · Dec 14, 2021 · US
Semiconductor device
US-11139291-B2 · Oct 5, 2021 · US
Wireless communication device and method
US-10959249-B2 · Mar 23, 2021 · US
Semiconductor device
US-10896961-B2 · Jan 19, 2021 · US
Semiconductor device
US-2020357904-A1 · Nov 12, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Fuji Electric Co Ltd | 26 |
| Ozaki Daisuke | 11 |
| Ricoh Co Ltd | 11 |
| Goto Hiroshi | 9 |
| Kobashi Toshiyuki | 9 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D12/481 | 24 |
| H10D64/117 | 17 |
| H10D62/127 | 17 |
| H01L29/7397 | 17 |
| H10D62/106 | 16 |