Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated component
US-2025287559-A1 · Sep 11, 2025 · US
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Otake Kohei patents
Otake Kohei is listed as an inventor on 32 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Otake Kohei |
| Total patents | 32 |
| First publication | Nov 22, 2018 |
| Latest publication | Sep 11, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated component
US-12342467-B2 · Jun 24, 2025 · US
Organopolysiloxane, ultraviolet-curable silicone composition and cured product
US-12202925-B2 · Jan 21, 2025 · US
Ultraviolet curable silicone composition and cured product thereof
US-12180320-B2 · Dec 31, 2024 · US
Ultraviolet ray curable silicone adhesive composition and cured product thereof
US-12168745-B2 · Dec 17, 2024 · US
Ultraviolet curable silicone composition and cured product thereof
US-2024228687-A9 · Jul 11, 2024 · US
Ultraviolet curable silicone composition and cured product thereof
US-2024132648-A1 · Apr 25, 2024 · US
Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving Plate
US-2024072203-A1 · Feb 29, 2024 · US
Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving Plate
US-2024063339-A1 · Feb 22, 2024 · US
Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate
US-11862755-B2 · Jan 2, 2024 · US
Recent patents
Latest publications not already listed above.
Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plate
US-11862754-B2 · Jan 2, 2024 · US
Addition-curing silicone pressure-sensitive adhesive composition and cured object obtained therefrom
US-2023348758-A1 · Nov 2, 2023 · US
Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving Plate
US-2023018855-A1 · Jan 19, 2023 · US
Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving Plate
US-2022359785-A1 · Nov 10, 2022 · US
Method for transferring microstructures, and method for mounting microstructures
US-2022315418-A1 · Oct 6, 2022 · US
Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate
US-11417799-B2 · Aug 16, 2022 · US
Ultraviolet curable silicone composition for stereolithography and cured product of same
US-11370869-B2 · Jun 28, 2022 · US
Organopolysiloxane, ultraviolet-curable silicone composition and cured product
US-2022135744-A1 · May 5, 2022 · US
Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated component
US-2022124949-A1 · Apr 21, 2022 · US
Uv curable silicone adhesive composition and cured product thereof
US-2022033690-A1 · Feb 3, 2022 · US
Ultraviolet curable silicone adhesive composition and cured product of same
US-2022017790-A1 · Jan 20, 2022 · US
Ultraviolet ray curable silicone adhesive composition and cured product thereof
US-2022002595-A1 · Jan 6, 2022 · US
UV curable silicone adhesive composition and cured product thereof
US-11180680-B2 · Nov 23, 2021 · US
Ultraviolet curable silicone composition and cured product thereof
US-2021332175-A1 · Oct 28, 2021 · US
Ultraviolet curable silicone composition for stereolithography and cured product of same
US-2021309782-A1 · Oct 7, 2021 · US
Ultraviolet-curable pressure-sensitive silicone adhesive composition and cured object obtained therefrom
US-11124680-B2 · Sep 21, 2021 · US
Silicone-modified epoxy resin composition and semiconductor device
US-11028269-B2 · Jun 8, 2021 · US
Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving Plate
US-2021066541-A1 · Mar 4, 2021 · US
Silicone-modified epoxy resin composition and semiconductor device
US-2020392340-A1 · Dec 17, 2020 · US
Uv curable silicone adhesive composition and cured product thereof
US-2020270481-A1 · Aug 27, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Shinetsu Chemical Co | 32 |
| Semileds Corp | 7 |
| Samileds Corp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C08G77/20 | 14 |
| H10H20/018 | 12 |
| H10H20/036 | 10 |
| C09J183/04 | 10 |
| C09J2483/00 | 10 |