Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated component

Patent metadata

Field	Value
Publication number	US-12342467-B2
Application number	US-201917427437-A
Country	US
Kind code	B2
Filing date	Dec 10, 2019
Priority date	Feb 12, 2019
Publication date	Jun 24, 2025
Grant date	Jun 24, 2025

Abstract

A stamp head unit including: a stamp component including at least a silicone-based rubber film on a quartz glass substrate; a stamp-component-holding component including a surface having a hole for vacuum suction of a surface of the quartz glass substrate of the stamp component; and a tubular component having an evacuation suction hole connected to communicate with the hole for vacuum suction so as to maintain a vacuum, and being coupled and fixed with the stamp-component-holding component. This provides: a stamp component that can be fixed stably by a simple and convenient vacuum chuck system; a stamp head unit with which the stamp component can be replaced in a short time; and a microstructure-transfer apparatus provided with the stamp component and the stamp head unit.

First claim

The invention claimed is:

1. A stamp head unit comprising:
a stamp component comprising at least a silicone-based rubber film on a quartz glass substrate;
a stamp-component-holding component comprising a surface having a hole for vacuum suction of a surface of the quartz glass substrate of the stamp component; and
a tubular component having an evacuation suction hole connected to communicate with the hole for vacuum suction so as to maintain a vacuum, and being coupled and fixed with the stamp-component-holding component,
wherein the quartz glass substrate does not include through holes in a stamp area.

2. The stamp head unit according to claim 1 , wherein the hole of the stamp-component-holding component for vacuum suction is divided into a plurality of parts to fix the quartz glass substrate by suction in a plurality of points.

3. The stamp head unit according to claim 1 , wherein a groove structure is formed on the surface of the stamp-component-holding component to which the stamp component is attached, the groove structure being connected to the evacuation suction hole via the hole for vacuum suction.

4. The stamp head unit according to claim 1 , wherein the quartz glass substrate is a flat rectangular plate.

5. The stamp head unit according to claim 1 , wherein a facet is formed in the quartz glass substrate.

6. The stamp head unit according to claim 1 , wherein the tubular component has a collet connector portion.

7. The stamp head unit according to claim 1 , wherein the surface of the stamp-component-holding component for holding the stamp component comprises a convex structure for adjusting a position of the stamp component.

8. The stamp head unit according to claim 7 , wherein the convex structure has an orthogonal side surface.

9. The stamp head unit according to claim 1 , wherein the silicone-based rubber film of the stamp component has an alignment mark.

10. The stamp head unit according to claim 1 , wherein the quartz glass substrate is synthetic quartz glass.

11. A microstructure-transfer apparatus comprising the stamp head unit according to claim 1 .

12. The microstructure-transfer apparatus according to claim 11 , comprising a mechanism for adjusting a position of a stamp surface in X-Y orthogonal coordinates, a position in a Z-coordinate that is orthogonal to an X-Y plane, and rotation angle θ with a Z-axis as a center, of the stamp component mounted on the stamp head unit.

13. The microstructure-transfer apparatus according to claim 11 , comprising a unit for replacing the stamp component.

14. A method for transferring a microstructure-integrated component, the method comprising:
transferring a microstructure by using the microstructure-transfer apparatus according to claim 11 .

15. A stamp component for transferring a microstructure, the stamp component having at least one layer of a silicone-based rubber film formed on a synthetic quartz glass substrate,
wherein the quartz glass substrate does not include through holes in a stamp area.

16. The stamp component for transferring a microstructure according to claim 15 , wherein the synthetic quartz glass substrate has a thickness of 0.5 mm to 7 mm.

17. The stamp component for transferring a microstructure according to claim 15 , wherein there is a difference of 18 μm or less between a maximum and minimum film thickness of a silicone-based rubber of the silicone-based rubber film in a face portion that adheres to the microstructure.

18. The stamp component for transferring a microstructure according to claim 15 , comprising a conductive film between the synthetic quartz glass substrate and the silicone-based rubber film.

19. The stamp component for transferring a microstructure according to claim 18 , wherein the conductive film is formed to cover an entire surface of the synthetic quartz glass substrate.

20. The stamp component for transferring a microstructure according to claim 18 , wherein the conductive film contains a conductive material.

21. The stamp component for transferring a microstructure according to claim 20 , wherein the conductive material is at least one of carbon black, carbon filler, carbon nanowire, carbon nanotube, graphene, salt of alkali metal or alkaline-earth metal, and ionic liquid.

22. The stamp component for transferring a microstructure according to claim 20 , wherein the conductive material contains at least a conductive polymer.

23. The stamp component for transferring a microstructure according to claim 18 , wherein the conductive film is a conductive silicone-based rubber film.

24. The stamp component for transferring a microstructure according to claim 15 , wherein the silicone-based rubber film is a conductive silicone-based rubber film.

25. The stamp component for transferring a microstructure according to claim 23 , wherein the conductive silicone-based rubber film contains a conductive material.

26. The stamp component for transferring a microstructure according to claim 25 , wherein the conductive material contained in the conductive silicone-based rubber film is at least one of carbon black, carbon filler, carbon nanowire, carbon nanotube, graphene, salt of alkali metal or alkaline-earth metal, and ionic liquid.

27. The stamp component for transferring a microstructure according to claim 25 , wherein the conductive material contained in the conductive silicone-based rubber film contains at least a conductive polymer.

28. The stamp component for transferring a microstructure according to claim 15 , comprising one convex-shaped projection on a surface of the silicone-based rubber film.

29. The stamp component for transferring a microstructure according to claim 15 , comprising two or more convex-shaped projections on a surface of the silicone-based rubber film.

30. The stamp component for transferring a microstructure according to claim 29 , wherein the two or more convex-shaped projections include convex-shaped projections having two or more different heights.

31. The stamp component for transferring a microstructure according to claim 29 , wherein the two or more convex-shaped projections have a face portion that is to be contacted with a microstructure, and comprise convex-shaped projections whose face portions have two or more different areas.

32. The stamp component for transferring a microstructure according to claim 29 , wherein the two or more convex-shaped projections are optionally in a one-dimensional array or a two-dimensional array.

33. The stamp component for transferring a microstructure according to claim 32 , wherein the one-dimensional array or two-dimensional array includes a portion having a regularity with a fixed pitch.

34. The stamp component for transferring a microstructure according to claim 33 , wherein the fixed pitch is an integer multiple of a pixel pitch of a display.

35. The stamp component for transferring a microstructure according to claim 28 , wherein a cross sectional shape of the convex-shaped projection is a trapezoidal shape.

36. The stamp component for transferring a microstructure according to claim 35 , wherein the cross sectional shape of the convex-shaped projection comprises a portion that is a trapezoidal shape that is smaller in a tip side.

Assignees

• Shinetsu Chemical Co

Inventors

• Nakagawa Hideo
• Ogawa Yoshinori
• Matsumoto Nobuaki
• Ueda Shuhei
• OHORI Keiji
• Otake Kohei

Classifications

• H10W90/00

  Package configurations · CPC title

• H10P72/0446 Primary

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• H10P72/3302

  Mechanical parts of transfer devices · CPC title

• H10P72/78 Primary

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10H20/018 Primary

  Bonding of wafers · CPC title