Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate

Patent metadata

Field	Value
Publication number	US-11417799-B2
Application number	US-202016987478-A
Country	US
Kind code	B2
Filing date	Aug 7, 2020
Priority date	Aug 28, 2019
Publication date	Aug 16, 2022
Grant date	Aug 16, 2022

Abstract

A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

First claim

What is claimed is:

1. A method for fabricating light emitting diode (LED) dice comprising:
providing a substrate;
forming a plurality of die sized semiconductor structures on the substrate;
providing a receiving plate having an elastomeric polymer layer;
placing the substrate and the receiving plate in physical contact to apply an adhesive force to the semiconductor structures on the substrate;
performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface of the semiconductor structures with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer; and
removing the semiconductor structures from the receiving plate.

2. The method of claim 1 further comprising selecting a laser wavelength and power such that the laser beam can transmit through the substrate and be absorbed by the semiconductor layer at the interface with the substrate.

3. The method of claim 1 wherein during the laser lift-off (LLO) process, the laser beam is focused on the semiconductor structures at least one at a time in sequence to remove either all of the semiconductor structures, or just selected semiconductor structure on the substrate.

4. A method for fabricating light emitting diode (LED) dice comprising:
providing a substrate comprising a sapphire wafer;
forming a plurality of die sized semiconductor structures on the substrate;
providing a receiving plate having an elastomeric polymer layer, the receiving plate comprising a plate larger than the wafer;
placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer; and
performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer.

5. The method of claim 4 wherein the elastomeric polymer layer on the receiving plate comprises a pressure sensitive adhesive.

6. The method of claim 4 wherein the providing the receiving plate step comprises applying the elastomeric polymer layer to the receiving plate.

7. The method of claim 4 wherein an excimer laser is used for the laser lift-off (LLO) process.

8. The method of claim 4 wherein the semiconductor structures comprise vertical light emitting diode (VLED) dice or flip chip light emitting diode dice (FCLED).

9. A method for fabricating light emitting diode (LED) dice comprising:
providing a substrate comprising sapphire;
forming a plurality of die sized semiconductor structures on the substrate, each semiconductor structure comprising an epitaxial stack that includes a GaN layer;
providing a receiving plate having an elastomeric polymer layer comprising a pressure sensitive curable silicone adhesive;
placing the substrate and the receiving plate in physical contact and applying a weight such that an adhesive force applies to the semiconductor structures by the elastomeric polymer layer;
performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at a sapphire/GaN interface of the semiconductor structures on the substrate to lift off the semiconductor structures onto the elastomeric polymer layer, and with the elastomeric polymer layer holding the semiconductor structures in place on the receiving plate following the laser lift-off (LLO) process; and
removing the semiconductor structures from the receiving plate.

10. A method for fabricating light emitting diode (LED) dice comprising:
providing a substrate comprising sapphire;
forming a plurality of die sized semiconductor structures on the substrate, each semiconductor structure comprising an epitaxial stack that includes a GaN layer;
providing a receiving plate having an elastomeric polymer layer that comprises a spin-on polymer,
placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer; and
performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at a sapphire/GaN interface on the substrate to lift off the semiconductor structures onto the elastomeric polymer layer, and with the elastomeric polymer layer holding the semiconductor structures in place on the receiving plate following the laser lift-off (LLO) process.

11. The method of claim 10 further comprising selecting a laser wavelength and power such that during the laser lift-off (LLO) process the laser beam can transmit through the substrate and be absorbed by the semiconductor layer at the interface with the substrate.

12. A method for fabricating light emitting diode (LED) dice comprising:
providing a substrate comprising sapphire;
forming a plurality of die sized semiconductor structures on the substrate, each semiconductor structure comprising an epitaxial stack that includes a GaN layer and wherein the semiconductor structures comprise flip chip light emitting diode (FCLED) dice, with each (FCLED) die comprising a p-type confinement layer, an n-type confinement layer, an active layer between confinement layers configured to emit light, P-metal layers making contact to the p-type confinement layer, and an N-electrode making contact to the n-type confinement layer;
providing a receiving plate having an elastomeric polymer layer comprising a pressure sensitive curable silicone adhesive;
placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer; and
performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at a sapphire/GaN interface on the substrate to lift off the semiconductor structures onto the elastomeric polymer layer, and with the elastomeric polymer layer holding the semiconductor structures in place on the receiving plate following the laser lift-off (LLO) process.

13. A method for fabricating light emitting diode (LED) dice comprising:
providing a substrate comprising sapphire;
forming a plurality of die sized semiconductor structures on the substrate, each semiconductor structure comprising an epitaxial stack that includes a GaN layer;
providing a receiving plate having an elastomeric polymer layer comprising a pressure sensitive curable silicone adhesive;
placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer by placing a weight on the receiving plate and curing the elastomeric polymer layer; and
performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at a sapphire/GaN interface on the substrate to lift off the semiconductor structures onto the elastomeric polymer layer, and with the elastomeric polymer layer holding the semiconductor structures in place on the receiving plate following the laser lift-off (LLO) process.

14. A method for fabricating light emitting diode (LED) dice comprising:
providing a substrate comprising sapphire;
forming a plurality of die sized semiconductor structures on the substrate, each semiconductor structure comprising an epitaxial stack that includes a GaN layer;
providing a receiving plate having an elastomeric polymer layer comprising a pressure sensitive curable silicone adhesive;
placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer; and
performing a laser lift-off (L

Assignees

• Semileds Corp
• Shinetsu Chemical Co

Inventors

• Chu Chen-Fu
• Chan Shih-Kai
• Shih Yi-Feng
• Doan David Trung
• Doan Trung Tri
• Ogawa Yoshinori
• Otake Kohei
• Kondo Kazunori
• OHORI Keiji
• Kitagawa Taichi
• Matsumoto Nobuaki
• Ozai Toshiyuki
• Ueda Shuhei

Classifications

• H10H20/036

  of packages · CPC title

• H10H20/01

  Manufacture or treatment · CPC title

• H10H20/0137

  the light-emitting regions comprising nitride materials · CPC title

• H10H20/018 Primary

  Bonding of wafers · CPC title

• H10H20/034

  of coatings · CPC title