Ultraviolet curable silicone adhesive composition and cured product of same

Patent metadata

Field	Value
Publication number	US-2022017790-A1
Application number	US-201917299598-A
Country	US
Kind code	A1
Filing date	Nov 15, 2019
Priority date	Dec 7, 2018
Publication date	Jan 20, 2022
Grant date	—

Abstract

An ultraviolet curable silicone adhesive composition which contains (A) an organopolysiloxane represented by formula (1)(wherein each R1 represents a polymerizable group or a monovalent hydrocarbon group having 1-20 carbon atoms, provided that at least one of the R1 moieties represents a polymerizable group; R2 represents an oxygen atom or an alkylene group having 1-20 carbon atoms; and m and n represent numbers satisfying m≥0, n≥1 and 1 (m+n)≥1,000), (B) an organopolysiloxane resin which is composed of (a) an R33SiO1/2 unit (wherein R3 represents a monovalent hydrocarbon group having 1-10 carbon atoms) and (b) an SiO4/2 unit, with the molar ratio of the unit (a) to the unit (b) being 0.6-1.2:1, (C) a fine silica powder and (D) a photopolymerization initiator, and which does not contain a (meth)acrylate compound that does not have a siloxane structure. This ultraviolet curable silicone adhesive composition enables the achievement of a cured product that has good shape retainability and little curing shrinkage, while exhibiting excellent adhesiveness if used as a provisional fixing material.

First claim

1 . A UV-curable silicone pressure-sensitive adhesive composition comprising:
(A) 100 parts by weight of an organopolysiloxane having the general formula (1):

wherein R 1 is each independently a polymerizable group selected from acryloyloxyalkyl, methacryloyloxyalkyl, acryloyloxyalkyloxy and methacryloyloxyalkyloxy groups, or a C 1 -C 20 monovalent hydrocarbon group, at least one R 1 being the polymerizable group,
R 2 is each independently oxygen or a C 1 -C 20 alkylene group,
m is a number of at least 0, and n is a number of at least 1, meeting 1≤m+n≤1,000,

(B) 1 to 1,000 parts by weight of an organopolysiloxane resin comprising (a) R 3 3 SiO 1/2 units wherein R 3 is a C 1 -C 10 monovalent hydrocarbon group, and (b) SiO 4/2 units, a molar ratio of units (a) to units (b) being in the range of from 0.6/1 to 1.2/1,
(C) 1 to 100 parts by weight of finely divided silica, and
(D) 0.01 to 20 parts by weight of a photopolymerization initiator, the composition not containing a (meth)acrylate compound free of a siloxane structure.

2 . The UV-curable silicone pressure-sensitive adhesive composition of claim 1 , which has a ratio of viscosity A as measured at frequency 1 Hz to viscosity B as measured at frequency 10 Hz both at 23° C., i.e., thixotropic ratio A/B of from 1.1 to 10.

3 . The UV-curable silicone pressure-sensitive adhesive composition of claim 1 , wherein the viscosity B as measured at frequency 10 Hz is in the range of 10 to 5,000 Pa·s.

4 . A cured product of the UV-curable silicone pressure-sensitive adhesive composition of claim 1 .

5 . A pressure-sensitive adhesive agent comprising the cured product of claim 4 .

6 . A pressure-sensitive adhesive sheet comprising the cured product of claim 4 .

7 . A microstructure-transferring stamp comprising the cured product of claim 4 .

8 . The microstructure-transferring stamp of claim 7 having at least one protrusion structure.

9 . A microstructure-transferring apparatus comprising the microstructure-transferring stamp of claim 7 .

10 . A microstructure-holding substrate having a pressure-sensitive adhesive layer comprising the cured product of claim 4 .

11 . A microstructure-transferring apparatus comprising the microstructure-holding substrate of claim 10 .

Assignees

• Shinetsu Chemical Co

Inventors

• Kitagawa Taichi
• Matsumoto Nobuaki
• Otake Kohei

Classifications

• C08G77/70

  Siloxanes defined by use of the MDTQ nomenclature · CPC title

• C08G77/20

  containing silicon bound to unsaturated aliphatic groups · CPC title

• C09J183/04 Primary

  Polysiloxanes · CPC title

• C08F290/06

  Polymers provided for in subclass C08G · CPC title

• C09J2203/326

  for bonding electronic components such as wafers, chips or semiconductors · CPC title