Ultraviolet ray curable silicone adhesive composition and cured product thereof

Patent metadata

Field	Value
Publication number	US-12168745-B2
Application number	US-201917292609-A
Country	US
Kind code	B2
Filing date	Oct 25, 2019
Priority date	Nov 21, 2018
Publication date	Dec 17, 2024
Grant date	Dec 17, 2024

Abstract

(A) an organopolysiloxane having, per molecule, two groups each represented by formula (1)

(R 1 represents a C 1-20 monovalent hydrocarbon group, R 2 represents an oxygen atom or the like, R 3 represents an acryloyloxyalkyl group or the like, and p and a respectively represent numbers satisfying 0-10 and 1-3);
(B) a monofunctional (meth)acrylate compound not including a siloxane structure; (C) an organopolysiloxane resin which comprises a unit (a) represented by formula (2)

(R 1 , R 2 , R 3 , a, and p are identical to those described above), a R 4 3 SiO 1/2 unit (b) (in the formula, R 4 represents a monovalent hydrocarbon group having 1-10 carbon atoms), and a SiO 4/2 unit (c), and in which the mole ratio of the total of units (a) and (b) to unit (c) is in a range of 0.4 to 1.2:1; and
(D) a photoinitiator.

First claim

The invention claimed is:

1. A UV-curable silicone pressure-sensitive adhesive composition comprising:
(A) 100 parts by weight of an organopolysiloxane containing per molecule two groups having the general formula (1):

wherein R 1 is each independently a C 1 -C 20 monovalent hydrocarbon group, R 2 is oxygen or a C 1 -C 20 alkylene group, R 3 is each independently an acryloyloxyalkyl, methacryloyloxyalkyl, acryloyloxyalkyloxy or methacryloyloxyalkyloxy group, p is a number of 0 to 10, and “a” is a number of 1 to 3,
(B) 1 to 200 parts by weight of a monofunctional (meth)acrylate compound free of a siloxane structure,
(C) 1 to 1,000 parts by weight of an organopolysiloxane resin comprising (a) units having the general formula (2):

wherein R 1 , R 2 , R 3 , a, and p are as defined above, (b) R 4 3 SiO 1/2 units wherein R 4 is a C 1 -C 10 monovalent hydrocarbon group, and (c) SiO 4/2 units, a molar ratio of the total of units (a) and (b) to units (c) being in the range of from 0.4:1 to 1.2:1, and
(D) 0.01 to 20 parts by weight of a photopolymerization initiator,
the composition being free of a non-crosslinkable organopolysiloxane resin, wherein the monofunctional (meth)acrylate compound free of a siloxane structure (B) is at least one of isoamyl acrylate, lauryl acrylate, stearyl acrylate, ethoxy-diethylene glycol acrylate, methoxy-triethylene glycol acrylate, 2-ethylhexyl diglycol acrylate, phenoxyethyl acrylate, phenoxydiethylene glycol acrylate, tetrahydrofurfuryl acrylate, and isobornyl acrylate.

2. The UV-curable silicone pressure-sensitive adhesive composition of claim 1 , further comprising (E) 1 to 20 parts by weight of finely divided silica per 100 parts by weight of component (A).

3. The UV-curable silicone pressure-sensitive adhesive composition of claim 1 , further comprising (F) 0.001 to 10 parts by weight of an antistatic agent per 100 parts by weight of component (A).

4. A cured product of the UV-curable silicone pressure-sensitive adhesive composition of claim 1 .

5. The cured product of claim 4 having a tensile strength of at least 1 MPa according to JIS-K6249 at a thickness of 2.0 mm.

6. A pressure-sensitive adhesive agent comprising the cured product of claim 4 .

7. A pressure-sensitive adhesive sheet comprising the cured product of claim 4 .

8. A microstructure-transferring stamp comprising the cured product of claim 4 .

9. The microstructure-transferring stamp of claim 8 having at least one protrusion structure.

10. A microstructure-transferring apparatus comprising the microstructure-transferring stamp of claim 8 .

Assignees

• Shinetsu Chemical Co

Inventors

• Otake Kohei
• Kitagawa Taichi
• Matsumoto Nobuaki
• Ozai Toshiyuki
• Ogawa Yoshinori

Classifications

• C09J2483/00

  Presence of polysiloxane · CPC title

• C09J2433/00

  Presence of (meth)acrylic polymer · CPC title

• C09J2203/326

  for bonding electronic components such as wafers, chips or semiconductors · CPC title

• C09J11/04

  inorganic · CPC title

• C09J4/06

  {Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond} in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00 · CPC title