Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern
US-11328835-B2 · May 10, 2022 · US
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Ohno Eiichi patents
Ohno Eiichi is listed as an inventor on 9 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ohno Eiichi |
| Total patents | 9 |
| First publication | Jun 2, 2016 |
| Latest publication | May 10, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern
US-11270809-B2 · Mar 8, 2022 · US
Dispersion
US-11104813-B2 · Aug 31, 2021 · US
Dispersing Element, Method for Manufacturing Structure with Conductive Pattern Using the Same, and Structure with Conductive Pattern
US-2021225551-A1 · Jul 22, 2021 · US
Dispersing Element, Method for Manufacturing Structure with Conductive Pattern Using the Same, and Structure with Conductive Pattern
US-2020013521-A1 · Jan 9, 2020 · US
Copper and/or copper oxide dispersion, and electroconductive film formed using dispersion
US-2019371901-A1 · Dec 5, 2019 · US
Copper and/or copper oxide dispersion, and electroconductive film formed using dispersion
US-10424648-B2 · Sep 24, 2019 · US
Dispersion
US-2018171159-A1 · Jun 21, 2018 · US
Copper and/or copper oxide dispersion, and electroconductive film formed using dispersion
US-2016155814-A1 · Jun 2, 2016 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Asahi Chemical Ind | 9 |
Top CPC classifications
Most common classification codes across this inventor's patents.