Dispersing Element, Method for Manufacturing Structure with Conductive Pattern Using the Same, and Structure with Conductive Pattern

Patent metadata

Field	Value
Publication number	US-2020013521-A1
Application number	US-201816491115-A
Country	US
Kind code	A1
Filing date	Mar 15, 2018
Priority date	Mar 16, 2017
Publication date	Jan 9, 2020
Grant date	—

Abstract

A conductive pattern having high dispersion stability and a low resistance over a board is formed. A dispersing element ( 1 ) contains a copper oxide ( 2 ), a dispersing agent ( 3 ), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersing agent is in a range of a following formula (2).
0.0001≤(reductant mass/copper oxide mass)≤0.10  (1)

0.0050≤(dispersing agent mass/copper oxide mass)≤0.30  (2)

The dispersing element containing the reductant promotes reduction of copper oxide to copper in firing and promotes sintering of the copper.

First claim

1 . A dispersing element comprising:
a copper oxide, a dispersing agent, and a reductant, wherein content of the reductant is in a range of a following formula (1), and content of the dispersing agent is in a range of a following formula (2).
0.0001≤(reductant mass/copper oxide mass)≤0.10  (1)

0.0050≤(dispersing agent mass/copper oxide mass)≤0.30  (2)

2 . A dispersing element comprising:
a copper oxide having a particle diameter of 1 nm or more to 50 nm or less; copper particles having particle diameters of 0.1 μm or more to 100 μm or less; and an organic compound having a phosphate group.

3 . A dispersing element comprising:
a copper oxide and at least one kind of copper particles having shapes extending in one direction, dendritic shapes, or flat shapes.

4 . The dispersing element according to claim 1 , comprising
copper particles, the copper particles having shapes extending in one direction, dendritic shapes, or flat shapes.

5 . The dispersing element according to claim 3 , comprising
at least the copper particles having the dendritic shapes.

6 . The dispersing element according to claim 1 , wherein
the copper oxide has a particle diameter of 1 nm or more to 50 nm or less.

7 . The dispersing element according to claim 2 , wherein
the copper particles have a mass ratio to a mass of the copper oxide of 1.0 or more to 7.0 or less.

8 . The dispersing element according to claim 2 , wherein
the organic compound has a mass ratio to a mass of the copper oxide of 0.0050 or more to 0.30 or less.

9 . The dispersing element according to claim 2 , comprising
a reductant, wherein the reductant has a mass ratio to a mass of the copper oxide of 0.0001 or more to 0.10 or less.

10 . The dispersing element according to claim 1 , comprising
a reductant, the reductant containing at least one kind selected from the group consisting of a hydrazine, a hydrazine hydrate, a sodium, a carbon, a potassium iodide, an oxalic acid, an iron sulfide (II), a sodium thiosulfate, an ascorbic acid, a tin chloride (II), a diisobutylaluminium hydride, a formic acid, a sodium borohydride, and a sulfite.

11 . The dispersing element according to claim 1 , wherein
the copper oxide contains a cuprous oxide.

12 . The dispersing element according to claim 1 , further comprising
a dispersion medium, the dispersion medium being at least one kind selected from the group consisting of a terpineol, a γ-butyrolactone, a cyclohexanone, an ethanol, a propylene glycol, a butanol, a propanol, an ethylene glycol monoethyl ether acetate, and a tetralin.

13 . The dispersing element according to claim 1 , further comprising
a dispersion medium, two or more kinds of the dispersion mediums being contained.

14 . A method for manufacturing a structure with a conductive pattern comprising:
a step of applying the dispersing element according to claim 1 over a board to form an application film; and a step of irradiating the application film with laser light to form a conductive pattern on the board.

15 . A method for manufacturing a structure with a conductive pattern comprising:
a step of applying the dispersing element according to claim 1 over a board in a desired pattern to form an application film; and a step of performing a firing process on the application film to form a conductive pattern on the board.

16 . The method for manufacturing the structure with the conductive pattern according to claim 15 , wherein
the firing process is performed by generating plasma under an atmosphere containing a reducing gas.

17 . The method for manufacturing the structure with the conductive pattern according to claim 15 , wherein
the firing process is performed by a light irradiation method.

18 . The method for manufacturing the structure with the conductive pattern according to claim 15 , wherein
the firing process is performed by heating the application film with heat at 100° C. or more.

19 . The method for manufacturing the structure with the conductive pattern according to claim 15 , wherein
the dispersing element is applied by an aerosol method to form the desired pattern.

20 . The method for manufacturing the structure with the conductive pattern according to claim 15 , wherein
the dispersing element is applied by screen-printing.

21 . The method for manufacturing the structure with the conductive pattern according to claim 14 , wherein
after the application film is formed on a transfer body, the application film is transferred from the transfer body to the board to form the application film on the board.

22 . The method for manufacturing the structure with the conductive pattern according to claim 15 , comprising:
a step of applying the dispersing element over a transfer body and then contacting a convex portion with the transfer body and removing an unnecessary dispersing element to form a desired pattern on a surface of the transfer body; and a step of contacting the board with the surface of the transfer body to transfer the desired pattern to the board.

23 . The method for manufacturing the structure with the conductive pattern according to claim 14 , wherein
the conductive pattern is an antenna.

24 . The method for manufacturing the structure with the conductive pattern according to claim 23 , wherein
the conductive pattern has a mesh shape.

25 . The method for manufacturing the structure with the conductive pattern according to claim 14 , further comprising
a step of forming a solder layer on a part of a surface of the conductive pattern.

26 . The method for manufacturing the structure with the conductive pattern according to claim 25 , wherein
on the conductive pattern, an electronic component is soldered via the solder layer by a reflow method.

27 . A structure with a conductive pattern comprising:
a board; a cuprous-oxide-containing layer formed on a surface of the board; and a conductive layer formed on a surface of the cuprous-oxide-containing layer, wherein the conductive layer is a wiring having a wire width of 1 μm or more to 1000 μm or less, and the wiring contains a reduced copper.

28 . A structure with a conductive pattern comprising:
a board; a cuprous-oxide-containing layer formed on a surface of the board; and a conductive layer formed on a surface of the cuprous-oxide-containing layer, wherein the conductive layer is a wiring having a wire width of 1 μm or more to 1000 μm or less, and the wiring contains a reduced copper, a copper, and a tin.

29 . A structure with a conductive pattern comprising:
a board; and a conductive pattern formed on a surface of the board, wherein the conductive pattern is a wiring having a wire width of 1 μm or more to 1000 μm or less, and the wiring contains a reduced copper, a phosphorus, and a void.

30 . A structure with a conductive pattern comprising:
a board; and a conductive pattern formed on a surface of the board, wherein the conductive pattern is a wiring having a wire width of 1 μm or more to 1000 μm or less, and the wiring contains a reduced copper, a copper, and a tin.

31 . The structure with the conductive pattern according to claim 28 , wherein
the copper has a grain size of 0.1 μm or more to 100 μm or less.

32 . The stru

Assignees

• Asahi Chemical Ind

Inventors

• Ohno Eiichi
• Yumoto Toru
• Tsuruta Masanori

Classifications

• H05K2203/0117

  Pattern shaped electrode used for patterning, e.g. plating or etching · CPC title

• H05K3/1291

  Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets · CPC title

• H01B1/22 Primary

  the conductive material comprising metals or alloys · CPC title

• H01B13/008

  for manufacturing extensible conductors or cables · CPC title

• H05K1/092

  Dispersed materials, e.g. conductive pastes or inks · CPC title