Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern

Patent metadata

Field	Value
Publication number	US-11328835-B2
Application number	US-202117213500-A
Country	US
Kind code	B2
Filing date	Mar 26, 2021
Priority date	Mar 16, 2017
Publication date	May 10, 2022
Grant date	May 10, 2022

Abstract

A conductive pattern having high dispersion stability and a low resistance over a board is formed. A dispersing element (1) contains a copper oxide (2), a dispersing agent (3), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersing agent is in a range of a following formula (2).0.0001≤(reductant mass/copper oxide mass)≤0.10  (1)0.0050≤(dispersing agent mass/copper oxide mass)≤0.30  (2)The dispersing element containing the reductant promotes reduction of copper oxide to copper in firing and promotes sintering of the copper.

First claim

The invention claimed is:

1. A structure with a conductive pattern comprising:
a board;
a cuprous-oxide-containing layer formed on a surface of the board; and
a conductive layer formed on a surface of the cuprous-oxide-containing layer,
wherein the conductive layer is a wiring having a wire width of 1 μm or more to 1000 μm or less, and the wiring contains a reduced copper.

2. The structure with the conductive pattern according to claim 1 , wherein the conductive layer or the conductive pattern has a surface having a surface roughness of 500 nm or more to 4000 nm or less.

3. The structure with the conductive pattern according to claim 1 , wherein the wiring is usable as an antenna.

4. The structure with the conductive pattern according to claim 1 , wherein the conductive layer or the conductive pattern has a surface on which a solder layer is partially formed.

5. A structure with a conductive pattern comprising:
a board; and
a conductive pattern formed on a surface of the board,
wherein the conductive pattern is a wiring having a wire width of 1 μm or more to 1000 μm or less, and the wiring contains a reduced copper, a phosphorus, and a void.

6. A structure with a conductive pattern comprising:
a board; and
a conductive pattern formed on the board surface,
wherein the conductive pattern is a wiring having a wire width of 1 μm or more to 1000 μm or less, the wiring contains a reduced copper, a copper oxide, and a phosphorus, and a resin is disposed so as to cover the wiring.

7. A method for manufacturing a structure with a conductive pattern comprising:
a step of applying a dispersing element over a board to form an application film; and
a step of irradiating the application film with laser light to form a conductive pattern on the board,
wherein the dispersing element includes a copper oxide, a dispersing agent, and a reductant,
wherein content of the reductant is in a range of a following formula (1), and
wherein content of the dispersing agent is in a range of a following formula (2):
0.0001≤(reductant mass/copper oxide mass)≤0.10  (1)

0.0050≤(dispersing agent mass/copper oxide mass)≤0.30  (2).

8. The method for manufacturing the structure with the conductive pattern according to claim 7 , wherein after the application film is formed on a transfer body, the application film is transferred from the transfer body to the board to form the application film on the board.

9. The method for manufacturing the structure with the conductive pattern according to claim 7 , wherein the conductive pattern is an antenna.

10. The method for manufacturing the structure with the conductive pattern according to claim 9 , wherein the conductive pattern has a mesh shape.

11. The method for manufacturing the structure with the conductive pattern according to claim 7 , further comprising a step of forming a solder layer on a part of a surface of the conductive pattern.

12. The method for manufacturing the structure with the conductive pattern according to claim 11 , wherein on the conductive pattern, an electronic component is soldered via the solder layer by a reflow method.

13. The method for manufacturing the structure with the conductive pattern according to claim 7 , wherein the dispersing agent is a phosphorus-containing organic matter.

Assignees

• Asahi Chemical Ind

Inventors

• Ohno Eiichi
• Yumoto Toru
• Tsuruta Masanori

Classifications

• H05K3/105

  by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam · CPC title

• H05K3/1291

  Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets · CPC title

• H01B13/008

  for manufacturing extensible conductors or cables · CPC title

• H01B1/22 Primary

  the conductive material comprising metals or alloys · CPC title

• H01B1/026

  Alloys based on copper · CPC title