Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern

Patent metadata

Field	Value
Publication number	US-11270809-B2
Application number	US-201816491115-A
Country	US
Kind code	B2
Filing date	Mar 15, 2018
Priority date	Mar 16, 2017
Publication date	Mar 8, 2022
Grant date	Mar 8, 2022

Abstract

A conductive pattern having high dispersion stability and a low resistance over a board is formed. A dispersing element (1) contains a copper oxide (2), a dispersing agent (3), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersing agent is in a range of a following formula (2).0.0001≤(reductant mass/copper oxide mass)≤0.10  (1)0.0050≤(dispersing agent mass/copper oxide mass)≤0.30  (2)The dispersing element containing the reductant promotes reduction of copper oxide to copper in firing and promotes sintering of the copper.

First claim

The invention claimed is:

1. A dispersing element comprising:
a copper oxide, a dispersing agent, and a reductant,
wherein
the dispersing agent is a phosphorus-containing organic matter,
content of the reductant is in a range of a following formula (1), and
content of the dispersing agent is in a range of a following formula (2):
0.0001≤(reductant mass/copper oxide mass)≤0.10  (1)

0.0050≤(dispersing agent mass/copper oxide mass)≤0.30  (2).

2. The dispersing element according to claim 1 , wherein:
the copper oxide has a particle diameter of 1 nm or more to 50 nm or less;
the phosphorus-containing organic matter is an organic compound having a phosphate group; and
the dispersing element further comprises copper particles having particle diameters of 0.1 μm or more to 100 μm or less and having shapes extending in one direction, dendritic shapes, or flat shapes.

3. The dispersing element according to claim 2 , comprising at least the copper particles having the dendritic shapes.

4. The dispersing element according to claim 2 , wherein the copper particles have a mass ratio to a mass of the copper oxide of 1.0 or more to 7.0 or less.

5. The dispersing element according to claim 1 or claim 2 , comprising a reductant, the reductant containing at least one kind selected from the group consisting of a hydrazine, a hydrazine hydrate, a sodium, a carbon, a potassium iodide, an oxalic acid, an iron sulfide (II), a sodium thiosulfate, an ascorbic acid, a tin chloride (II), a diisobutylaluminium hydride, a formic acid, a sodium borohydride, and a sulfite.

6. The dispersing element according to claim 1 or claim 2 , further comprising a dispersion medium, the dispersion medium being at least one kind selected from the group consisting of a terpineol, a γ-butyrolactone, a cyclohexanone, an ethanol, a propylene glycol, a butanol, a propanol, an ethylene glycol monoethyl ether acetate, and a tetralin.

7. The dispersing element according to claim 1 or claim 2 , further comprising a dispersion medium, two or more kinds of the dispersion mediums being contained.

8. A method for manufacturing a structure with a conductive pattern comprising:
a step of applying the dispersing element according to claim 1 or claim 2 over a board in a desired pattern to form an application film; and
a step of performing a firing process on the application film to form a conductive pattern on the board.

9. The method for manufacturing the structure with the conductive pattern according to claim 8 , wherein the firing process is performed by generating plasma under an atmosphere containing a reducing gas.

10. The method for manufacturing the structure with the conductive pattern according to claim 8 , wherein the firing process is performed by a light irradiation method.

11. The method for manufacturing the structure with the conductive pattern according to claim 8 , wherein the firing process is performed by heating the application film with heat at 100° C. or more.

12. The method for manufacturing the structure with the conductive pattern according to claim 8 , wherein the dispersing element is applied by an aerosol method to form the desired pattern.

13. The method for manufacturing the structure with the conductive pattern according to claim 8 , wherein the dispersing element is applied by screen-printing.

14. The method for manufacturing the structure with the conductive pattern according to claim 8 , comprising:
a step of applying the dispersing element over a transfer body and then contacting a convex portion with the transfer body and removing an unnecessary dispersing element to form a desired pattern on a surface of the transfer body; and
a step of contacting the board with the surface of the transfer body to transfer the desired pattern to the board.

15. The dispersing element according to claim 1 or 2 , wherein a number average molecular weight of the dispersing agent is 1000 or more to 10000 or less.

16. The dispersing element according to claim 1 or 2 , wherein
the reductant comprises at least one selected from the group consisting of hydrazine, hydrazine hydrate, sodium, carbon, potassium iodide, oxalic acid, iron sulfide (II), sodium thiosulfate, ascorbic acid, tin chloride (II), diisobutylaluminum hydride, formic acid, sodium borohydride, and a sulfite, and
a content of the reductant is in a range of a following formula:
0.0001≤(reductant mass/copper oxide mass)≤0.015.

17. The dispersing element according to claim 1 , comprising copper particles, the copper particles having shapes extending in one direction, dendritic shapes, or flat shapes.

18. The dispersing element according to claim 1 , wherein the copper oxide has a particle diameter of 1 nm or more to 50 nm or less.

Assignees

• Asahi Chemical Ind

Inventors

• Ohno Eiichi
• Yumoto Toru
• Tsuruta Masanori

Classifications

• H05K3/1216

  by screen printing or stencil printing · CPC title

• H05K1/097 Primary

  Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence) · CPC title

• H01B13/00

  Apparatus or processes specially adapted for manufacturing conductors or cables · CPC title

• H01B1/22 Primary

  the conductive material comprising metals or alloys · CPC title

• H01B1/00

  Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors · CPC title