Apparatus for purifying semiconductor manufacturing chemical liquid
US-2026035274-A1 · Feb 5, 2026 · US
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Oh Junyoung patents
Oh Junyoung is listed as an inventor on 19 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Oh Junyoung |
| Total patents | 19 |
| First publication | Nov 5, 2020 |
| Latest publication | Feb 5, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Interposer and semiconductor package including the same
US-12087650-B2 · Sep 10, 2024 · US
Semiconductor chip stack structure and semiconductor package including the same
US-2024105680-A1 · Mar 28, 2024 · US
Method for acquiring information about state of battery on basis of voltage change amount of battery during charging, and electronic device for supporting same
US-11927640-B2 · Mar 12, 2024 · US
Apparatus for conducting plasma surface treatment, board treatment system having the same, and method of manufacturing semiconductor devices using the same
US-2023343560-A1 · Oct 26, 2023 · US
Interposer and semiconductor package including the same
US-2023282533-A1 · Sep 7, 2023 · US
Semiconductor package
US-11742329-B2 · Aug 29, 2023 · US
Interposers and semiconductor packages including the same
US-11742294-B2 · Aug 29, 2023 · US
Apparatus for conducting plasma surface treatment, board treatment system having the same
US-11728142-B2 · Aug 15, 2023 · US
Interposer and semiconductor package including the same
US-11688656-B2 · Jun 27, 2023 · US
Recent patents
Latest publications not already listed above.
Methods of manufacturing semiconductor package and package-on-package
US-11508713-B2 · Nov 22, 2022 · US
Interposers and semiconductor packages including the same
US-2022093519-A1 · Mar 24, 2022 · US
Semiconductor package
US-2021375831-A1 · Dec 2, 2021 · US
Interposer and semiconductor package including the same
US-2021320042-A1 · Oct 14, 2021 · US
Semiconductor package
US-11101243-B2 · Aug 24, 2021 · US
Method for acquiring information about state of battery on basis of voltage change amount of battery during charging, and electronic device for supporting same
US-2021255246-A1 · Aug 19, 2021 · US
Methods of manufacturing semiconductor package and package-on-package
US-2021242190-A1 · Aug 5, 2021 · US
Apparatus for conducting plasma surface treatment, board treatment system having the same, and method of manufacturing semiconductor devices using the same
US-2021066046-A1 · Mar 4, 2021 · US
Semiconductor package
US-2020350288-A1 · Nov 5, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 19 |
| New Power Plasma Co Ltd | 3 |
| Seoul Nat Univ R&Db Foundation | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 13 |
| H10W90/701 | 12 |
| H10W90/722 | 12 |
| H10W90/754 | 11 |
| H01L25/0657 | 11 |