Production method of additive manufactured object using pure copper powder having Si coating
US-11872647-B2 · Jan 16, 2024 · US
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Morioka Satoru patents
Morioka Satoru is listed as an inventor on 11 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Morioka Satoru |
| Total patents | 11 |
| First publication | Apr 28, 2016 |
| Latest publication | Jan 16, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
PRODUCTION METHOD OF ADDITIVE MANUFACTURED OBJECT USING PURE COPPER POWDER HAVING Si COATING
US-2021039192-A1 · Feb 11, 2021 · US
Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board
US-10464291-B2 · Nov 5, 2019 · US
Printed wiring board, electronic device, catheter, and metallic material
US-10194534-B2 · Jan 29, 2019 · US
Printed wiring board, electronic device, catheter, and metallic material
US-2018035546-A1 · Feb 1, 2018 · US
Structure having metal material for heat radiation, printed circuit board, electronic apparatus, and metal material for heat radiation
US-2018035529-A1 · Feb 1, 2018 · US
Structure Having Metal Material For Heat Radiation, Printed Circuit Board, Electronic Apparatus, And Metal Material For Heat Radiation
US-2017347493-A1 · Nov 30, 2017 · US
Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Connector, Terminal, Laminate, Shield Material, Printed-Wiring Board, Metal Processed Member, Electronic Device and Method for Manufacturing the Printed Wiring Board
US-2017291397-A1 · Oct 12, 2017 · US
Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board
US-9724896-B2 · Aug 8, 2017 · US
Surface-Treated Metal Material, Metal Foil With Carrier, Connector, Terminal, Laminate, Shielding Tape, Shielding Material, Printed Wiring Board, Processed Metal Member, Electronic Device, And Method For Manufacturing Printed Wiring Board
US-2016212836-A1 · Jul 21, 2016 · US
Recent patents
Latest publications not already listed above.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Jx Nippon Mining & Metals Corp | 11 |
| Jx Metals Corp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K2201/0355 | 7 |
| H05K1/0207 | 7 |
| H05K3/025 | 7 |
| H05K1/09 | 6 |
| H10W40/258 | 5 |