Printed wiring board, electronic device, catheter, and metallic material

Patent metadata

Field	Value
Publication number	US-10194534-B2
Application number	US-201715654801-A
Country	US
Kind code	B2
Filing date	Jul 20, 2017
Priority date	Jul 26, 2016
Publication date	Jan 29, 2019
Grant date	Jan 29, 2019

Abstract

Provided herein is a printed wiring board that can desirably dissipate the heat of a heat-generating component. The printed wiring board includes one or more wires, and one or more heat-generating components. The one or more wires include a rolled copper foil, either partly or as a whole. The one or more heat-generating components and the one or more wires are directly or indirectly connected to each other.

First claim

What is claimed is:

1. A printed wiring board comprising:
one or more wires; and
one or more heat-generating components,
wherein the one or more wires satisfy, either partly or as a whole, at least one of the following conditions (A) to (C):
(A) the one or more wires include a rolled copper foil, either partly or as a whole,
(B) the one or more wires include, either partly or as a whole, a material having a thermal conductivity of 330 W/(m·K) or more, and
(C) the one or more wires include, either partly or as a whole, a material having an electrical conductivity of 88% IACS or more, and
wherein the one or more heat-generating components and the one or more wires are directly or indirectly connected to each other.

2. A printed wiring board comprising:
one or more wires; and
one or more heat-generating components,
wherein the one or more heat-generating components and the one or more wires are directly or indirectly connected to each other, and
wherein the one or more wires are provided with a plurality of extraction wires that is adapted to discharge heat of the heat-generating components from the printed wiring board.

3. The printed wiring board according to claim 1 , wherein one of the one or more heat-generating components, more than one of the one or more heat-generating components, or all of the one or more heat-generating components are light-emitting components.

4. The printed wiring board according to claim 2 , wherein one of the one or more heat-generating components, more than one of the one or more heat-generating components, or all of the one or more heat-generating components are light-emitting components.

5. The printed wiring board according to claim 1 , wherein one of the one or more heat-generating components, more than one of the one or more heat-generating components, or all of the one or more heat-generating components have a heat quantity of 0.5 mW or more per component in terms of a quantity of heat that generates upon passing electricity.

6. The printed wiring board according to claim 1 , wherein at least one of the one or more wires has a length of 17 mm or more.

7. The printed wiring board according to claim 6 , wherein the one or more heat-generating components are directly or indirectly connected to the wire having a length or 17 mm or more.

8. The printed wiring board according to claim 1 , wherein the one or more wires are configured from, either partly or as a whole, a metal having a maximum crystal grain size of 5.0 μm or more in a cross section taken parallel to a thickness direction of the wire.

9. The printed wiring board according to claim 2 , wherein the one or more wires are configured from, either partly or as a whole, a metal having a maximum crystal grain size of 5.0 μm or more in a cross section taken parallel to a thickness direction of the wire.

10. The printed wiring board according to claim 3 , wherein the one or more wires are configured from, either partly or as a whole, a metal having a maximum crystal grain size of 5.0 μm or more in a cross section taken parallel to a thickness direction of the wire.

11. The printed wiring board according to claim 4 , wherein the one or more wires are configured from, either partly or as a whole, a metal having a maximum crystal grain size of 5.0 μm or more in a cross section taken parallel to a thickness direction of the wire.

12. The printed wiring board according to claim 1 , wherein one of the heat-generating components, more than one of the heat-generating components, or all of the heat-generating components comprise at least one selected from the group consisting of light emitting diodes, laser semiconductors, laser-generating devices, camera modules, antennas, and communication devices.

13. An electronic device comprising the printed wiring board of claim 1 .

14. An electronic device comprising the printed wiring board of claim 2 .

15. An electronic device comprising the printed wiring board of claim 8 .

16. An electronic device comprising the printed wiring board of claim 9 .

17. A catheter comprising the printed wiring board of claim 1 .

18. A catheter comprising the printed wiring board of claim 2 .

19. A catheter comprising the printed wiring board of claim 3 .

20. A catheter comprising the printed wiring board of claim 4 .

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Arai Hideta
• Miki Atsushi
• Morioka Satoru

Classifications

• H05K1/0203 Primary

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K2201/10106

  Light emitting diode [LED] · CPC title

• H05K2201/0355

  Metal foils · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K2201/0154

  Polyimide · CPC title