Structure to reduce chip shift during assembly
US-2024395758-A1 · Nov 28, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L24/29 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 5,267 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 317 |
| 2016 | 389 |
| 2017 | 494 |
| 2018 | 436 |
| 2019 | 500 |
| 2020 | 551 |
| 2021 | 436 |
| 2022 | 407 |
| 2023 | 459 |
| 2024 | 578 |
| 2025 | 587 |
| 2026 | 113 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Flip-chip mounting structure and flip-chip mounting method
US-2024387444-A1 · Nov 21, 2024 · US
Microelectronic assemblies with inductors in direct bonding regions
US-2024355768-A1 · Oct 24, 2024 · US
Inverter power module
US-2024258196-A1 · Aug 1, 2024 · US
Sensor packaging method and sensor package
US-2024222308-A1 · Jul 4, 2024 · US
Thermal expansion matched chip module with integrated liquid cooling
US-2024203822-A1 · Jun 20, 2024 · US
Copper/ceramic bonded body and insulating circuit substrate
US-2024203819-A1 · Jun 20, 2024 · US
Energy augmentation structures, energy emitters or energy collectors containing the same, and their use in solar cells and other energy conversion devices
US-2024115878-A1 · Apr 11, 2024 · US
Stacked semiconductor method and apparatus
US-2024096745-A1 · Mar 21, 2024 · US
Display device and method of fabricating the same
US-2024030390-A1 · Jan 25, 2024 · US
Electronic component module
US-9214617-B2 · Dec 15, 2015 · US
Integrated bondline spacers for wafer level packaged circuit devices
US-9187312-B2 · Nov 17, 2015 · US
Connection method, connection structure, insulating adhesive member, electronic component having adhesive member, and method for manufacturing same
US-9190381-B2 · Nov 17, 2015 · US
Semiconductor device and method of manufacturing the same
US-9177833-B2 · Nov 3, 2015 · US
Integrated bondline spacers for wafer level packaged circuit devices
US-9174836-B2 · Nov 3, 2015 · US
Embedding thin chips in polymer
US-9171794-B2 · Oct 27, 2015 · US
Adhesive film and electronic device including the same
US-9169425-B2 · Oct 27, 2015 · US
Flip chip interconnection having narrow interconnection sites on the substrate
US-9159665-B2 · Oct 13, 2015 · US
Active matrix emissive micro LED display
US-9159700-B2 · Oct 13, 2015 · US
Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die
US-9153476-B2 · Oct 6, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L24/29?
- CPC H01L24/29 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L24/29 (Electricity)?
- Our database includes 5,267 publications tagged with this CPC code.
- Is patent activity under CPC H01L24/29 growing?
- Publication counts under this code: 578 in 2024 vs 587 in 2025 (latest complete years).