High pressure wafer processing systems and related methods
US-12198951-B2 · Jan 14, 2025 · US
This page is not indexed by search engines while we improve data quality.
Malik Sultan patents
Malik Sultan is listed as an inventor on 24 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Malik Sultan |
| Total patents | 24 |
| First publication | Aug 4, 2016 |
| Latest publication | Jan 14, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Pin-less substrate transfer apparatus and method for a processing chamber
US-11948828-B2 · Apr 2, 2024 · US
Semiconductor processing system
US-11749555-B2 · Sep 5, 2023 · US
Gas delivery module
US-11361978-B2 · Jun 14, 2022 · US
Substrate transfer blade
US-D941787-S · Jan 25, 2022 · US
Gas abatement apparatus
US-11110383-B2 · Sep 7, 2021 · US
Pin-less substrate transfer apparatus and method for a processing chamber
US-2021225687-A1 · Jul 22, 2021 · US
Gas abatement apparatus
US-2020368666-A1 · Nov 26, 2020 · US
Gas delivery module
US-2020343103-A1 · Oct 29, 2020 · US
Gas delivery module
US-10748783-B2 · Aug 18, 2020 · US
Recent patents
Latest publications not already listed above.
In-situ CVD and ALD coating of chamber to control metal contamination
US-10704141-B2 · Jul 7, 2020 · US
Semiconductor processing system
US-2020185260-A1 · Jun 11, 2020 · US
Gas abatement apparatus
US-10675581-B2 · Jun 9, 2020 · US
Gas abatement apparatus
US-2020038797-A1 · Feb 6, 2020 · US
Processing apparatus
US-2020035513-A1 · Jan 30, 2020 · US
Gas delivery module
US-2020035509-A1 · Jan 30, 2020 · US
In-situ cvd and ald coating of chamber to control metal contamination
US-2019368035-A1 · Dec 5, 2019 · US
High temperature chuck for plasma processing systems
US-10468285-B2 · Nov 5, 2019 · US
Gas delivery system for high pressure processing chamber
US-10179941-B1 · Jan 15, 2019 · US
High pressure wafer processing systems and related methods
US-2018261480-A1 · Sep 13, 2018 · US
Substrate support with in situ wafer rotation
US-2018033673-A1 · Feb 1, 2018 · US
High temperature chuck for plasma processing systems
US-2017309509-A1 · Oct 26, 2017 · US
High temperature chuck for plasma processing systems
US-9728437-B2 · Aug 8, 2017 · US
High temperature chuck for plasma processing systems
US-2016225651-A1 · Aug 4, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 24 |
| Micromaterials Llc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/0402 | 14 |
| H10P72/0441 | 10 |
| H10P72/0432 | 8 |
| H10P72/0462 | 8 |
| H10P72/7612 | 8 |