Gas delivery module

Patent metadata

Field	Value
Publication number	US-11361978-B2
Application number	US-202016926422-A
Country	US
Kind code	B2
Filing date	Jul 10, 2020
Priority date	Jul 25, 2018
Publication date	Jun 14, 2022
Grant date	Jun 14, 2022

Abstract

The present disclosure relates to high pressure processing apparatus for semiconductor processing. The apparatus described herein include a high pressure process chamber and a containment chamber surrounding the process chamber. A high pressure fluid delivery module is in fluid communication with the high pressure process chamber and is configured to deliver a high pressure fluid to the process chamber.

First claim

What is claimed is:

1. A high pressure processing apparatus, comprising:
a first chamber body defining a first volume therein;
a second chamber body disposed within the first volume, the second chamber body defining a second volume therein;
a fluid delivery module in fluid communication with the second volume, the fluid delivery module comprising:
a first reservoir;
a first conduit extending between the first reservoir and the second volume;
a flow regulator disposed on the first conduit;
a second reservoir in fluid communication with one or more gas pumps; and
a second conduit extending between the second reservoir and the second volume.

2. The apparatus of claim 1 , wherein the first reservoir and the one or more gas pumps are fabricated from a nickel containing steel alloy.

3. The apparatus of claim 2 , wherein the nickel containing steel alloy comprises molybdenum.

4. The apparatus of claim 3 , wherein the nickel containing steel alloy comprises chromium.

5. The apparatus of claim 1 ,
wherein the second conduit is disposed within a heater jacket, the heater jacket being operable to maintain a temperature of the second conduit at a temperature greater than about 350° C.

6. The apparatus of claim 1 , wherein the plurality of gas pumps and the second reservoir are operable at pressures greater than about 50 bar.

7. The apparatus of claim 1 , further comprising:
an enclosure containing the first reservoir, the second reservoir, and the one or more gas pumps therein.

8. The apparatus of claim 1 , further comprising:
a first valve disposed on the first conduit;
a second valve disposed on the second conduit; and
a third valve disposed on the second conduit between the second valve and the first chamber body.

9. The apparatus of claim 8 , wherein the second conduit is disposed within a heater jacket, the heater jacket being operable to maintain a temperature of the second conduit at a temperature greater than about 350° C.

10. The apparatus of claim 1 , wherein the first volume defined by the first chamber body is between about 80 L and about 150 L.

11. The apparatus of claim 10 , wherein the second volume defined by the second chamber body is between about 3 L and about 8 L.

12. A high pressure processing apparatus, comprising:
an enclosure defining a volume therein;
a first reservoir disposed within the volume, the first reservoir comprising a plurality of ports;
a second reservoir disposed within the volume, the second reservoir comprising a plurality of ports;
a first gas pump;
a second gas pump disposed between the first gas pump and the second reservoir; and
a conduit extending between the second gas pump and the second reservoir.

13. The apparatus of claim 12 , wherein the enclosure further comprises:
a fluid inlet port; and
an exhaust port.

14. The apparatus of claim 12 , wherein the second reservoir, the first gas pump, and the second gas pump are fabricated from a nickel containing steel alloy.

15. The apparatus of claim 14 , wherein the nickel containing steel alloy comprises molybdenum.

16. The apparatus of claim 15 , wherein the nickel containing steel alloy comprises chromium.

17. A high pressure processing apparatus, comprising:
a first chamber body defining a first volume therein;
a first slit valve door coupled to the first chamber body;
a second chamber body disposed within the first volume, the second chamber body defining a second volume therein;
a second slit valve door coupled to the second chamber body;
a fluid delivery module in fluid communication with the second volume via a plurality of conduits, the fluid delivery module comprising:
a first reservoir in fluid communication with the second volume via a first conduit of the plurality;
a second reservoir comprising a fluid inlet port and a fluid outlet port, the second reservoir fabricated from a nickel containing steel alloy in fluid communication with the second volume via a second conduit; and
a plurality of gas pumps fabricated from the nickel containing steel alloy; and
a second gas pump fabricated from the nickel containing steel alloy, the second gas pump in fluid communication with each of the first gas pump and the second reservoir.

18. The apparatus of claim 17 , further comprising:
a flow regulator disposed on the first conduit between the first reservoir and the second volume.

19. The apparatus of claim 17 , wherein the first reservoir further comprises:
a fluid inlet port;
a first fluid outlet port; and
a second fluid outlet port.

20. The apparatus of claim 17 , wherein the plurality of gas pumps comprise a first gas pump and a second gas pump, wherein the second gas pump is in fluid communication with each of the first gas pump and the second reservoir.

Assignees

• Applied Materials Inc

Inventors

• Khan Adib M
• Liang Qiwei
• Malik Sultan
• Nemani Srinivas D

Classifications

• H10P72/04

  Apparatus for manufacture or treatment · CPC title

• H10P14/40 Primary

  of conductive or resistive materials · CPC title

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• H10P72/0402 Primary

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title