High pressure wafer processing systems and related methods

Patent metadata

Field	Value
Publication number	US-12198951-B2
Application number	US-201815917365-A
Country	US
Kind code	B2
Filing date	Mar 9, 2018
Priority date	Mar 10, 2017
Publication date	Jan 14, 2025
Grant date	Jan 14, 2025

Abstract

A high-pressure processing system for processing a substrate includes a first chamber, a pedestal positioned within the first chamber to support the substrate, a second chamber adjacent the first chamber, a vacuum processing system configured to lower a pressure within the second chamber to near vacuum, a valve assembly between the first chamber and the second chamber to isolate the pressure within the first chamber from the pressure within the second chamber, and a gas delivery system configured to introduce a processing gas into the first chamber and to increase the pressure within the first chamber to at least 10 atmospheres while the processing gas is in the first chamber and while the first chamber is isolated from the second chamber.

First claim

What is claimed is:

1. A combined processing chamber for processing a layer on a substrate, the combined processing chamber comprising:
a high-pressure chamber having a first ceiling, an outer wall, and a first base defining a first chamber volume,
a slit disposed through the outer wall from outside to inside the high-pressure chamber, the slit configured to receive a substrate therethrough;
a vacuum chamber having a second ceiling, a wall, and a second base defining a second chamber volume, the first chamber volume disposed within the second chamber volume, and an aperture disposed through the wall, wherein the wall of the vacuum chamber surrounds the outer wall of the high-pressure chamber;
a pedestal to support the substrate, the pedestal being positioned within the high-pressure chamber; and
a valve assembly configured to selectively isolate a pressure within the vacuum chamber from a pressure within the high-pressure chamber, wherein:
the valve assembly comprises an arm disposed through the slit and through the aperture,
the arm is movable in a first direction to engage an inner surface of the outer wall of the high-pressure chamber to seal or unseal the slit,
the arm is movable in a second direction to cover and uncover the slit,
the first direction is toward and away from the inner surface, and
the second direction is toward and away from the first ceiling and substantially perpendicular to the first direction.

2. The combined processing chamber of claim 1 , further comprising a vacuum processing system configured to lower a pressure within the vacuum chamber to near vacuum.

3. The combined processing chamber of claim 2 , further comprising a controller configured to operate the vacuum processing system.

4. The combined processing chamber of claim 2 , wherein the valve assembly further comprises an isolation valve configured to adjust the pressure within the vacuum chamber and to release gases within the vacuum chamber.

5. The combined processing chamber of claim 2 , wherein the valve assembly is openable to enable the substrate to be transferred from the high-pressure chamber into the vacuum chamber.

6. The combined processing chamber of claim 2 , further comprising:
a gas delivery system configured to introduce a processing gas into the high-pressure chamber through the first ceiling of the high-pressure chamber and to increase the pressure within the high-pressure chamber while the high-pressure chamber is isolated from the vacuum chamber, wherein the gas delivery system comprises an exhaust system to exhaust gas within the high-pressure chamber, thereby depressurizing the high-pressure chamber, and further comprising a controller configured to operate the exhaust system to depressurize the high-pressure chamber before the valve assembly is opened.

7. The combined processing chamber of claim 1 , further comprising a robot arm configured to transfer the substrate through the slit from the high-pressure chamber to the vacuum chamber.

8. The combined processing chamber of claim 1 , wherein the slit extends laterally between the high-pressure chamber and the vacuum chamber.

9. The combined processing chamber of claim 8 , wherein the arm is movable between a first position in which the arm covers the slit to form a seal between the high-pressure chamber and the vacuum chamber and a second position in which the slit is uncovered and the substrate is transferrable through the slit from the high-pressure chamber to the vacuum chamber.

10. The combined processing chamber of claim 9 , further comprising an actuator to move the arm relative to the slit, the actuator being coupled to a proximal end of the arm outside of the vacuum chamber.

11. The combined processing chamber of claim 1 , further comprising a heating element configured to apply heat to the substrate to anneal the substrate when the substrate is supported on the pedestal.

12. The combined processing chamber of claim 11 , wherein the heating element is positioned within the pedestal.

13. The combined processing chamber of claim 11 , wherein the heating element is positioned within the outer wall defining the high-pressure chamber.

14. The combined processing chamber of claim 1 , further comprising a lift pin assembly to lift the substrate from the pedestal.

15. The combined processing chamber of claim 1 , wherein the arm is disposed through an entire length of the slit.

16. The combined processing chamber of claim 1 , wherein the pedestal is suspended from the ceiling of the high-pressure chamber.

17. A combined processing chamber for processing a layer on a substrate, the combined processing chamber comprising:
a high-pressure chamber having a first ceiling, an outer wall, and a first base defining a first chamber volume,
a slit disposed through the outer wall from outside to inside the high-pressure chamber, the slit configured to receive a substrate therethrough;
a vacuum chamber having a second ceiling, a wall, and a second base defining a second chamber volume, the first chamber volume disposed within the second chamber volume, and an aperture disposed through the wall, wherein the vacuum chamber surrounds the outer wall of the high-pressure chamber;
a pedestal to support the substrate, the pedestal being positioned within the high-pressure chamber;
a gas delivery system configured to introduce a processing gas into the high-pressure chamber to increase a pressure within the high-pressure chamber while the high-pressure chamber is isolated from the vacuum chamber; and
a valve assembly configured to selectively isolate a pressure within the vacuum chamber from the pressure within the high-pressure chamber, the valve assembly disposed within the wall of the vacuum chamber; wherein:
the valve assembly comprises an arm disposed through the slit,
the arm is movable in a first direction to engage and disengage an inner surface of the outer wall of the high-pressure chamber to seal or unseal the slit,
the arm is movable in a second direction to cover and uncover the slit,
the first direction is toward and away from the inner surface; and
the second direction is toward and away from the first ceiling and substantially perpendicular to the first direction.

Assignees

• Applied Materials Inc

Inventors

• Liang Qiwei
• Nemani Srinivas D
• Khan Adib
• Kasibhotla Venkata Ravishankar
• Malik Sultan
• Kang Sean S
• WONG Keith Tatseun

Classifications

• H10P72/0432

  mainly by conduction · CPC title

• H10P95/90

  Thermal treatments, e.g. annealing or sintering · CPC title

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title

• H10P72/0466

  characterised by the construction of the load-lock chamber · CPC title

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title