MEMS capping method
US-9731960-B2 · Aug 15, 2017 · US
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Ma Junde patents
Ma Junde is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ma Junde |
| Total patents | 10 |
| First publication | Oct 22, 2015 |
| Latest publication | Aug 15, 2017 |
Notable patents
Publications ranked by popularity score, then publication date.
Wafer bonding structures and wafer processing methods
US-9640451-B2 · May 2, 2017 · US
Semiconductor device, related manufacturing method, and related electronic device
US-9620427-B2 · Apr 11, 2017 · US
Semiconductor device, related manufacturing method, and related electronic device
US-2016233138-A1 · Aug 11, 2016 · US
Mems capping method
US-2016152467-A1 · Jun 2, 2016 · US
Semiconductor device, related manufacturing method, and related electronic device
US-9352957-B2 · May 31, 2016 · US
MEMS capping method
US-9290378-B2 · Mar 22, 2016 · US
Semiconductor device, related manufacturing method, and related electronic device
US-2016031706-A1 · Feb 4, 2016 · US
Wafer bonding structures and wafer processing methods
US-2015380327-A1 · Dec 31, 2015 · US
Mems capping method
US-2015298968-A1 · Oct 22, 2015 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Semiconductor Mfg Int Shanghai | 6 |
| Semiconductor Mfg Int Shanghai Corp | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B81C2203/0109 | 4 |
| B81B7/0058 | 4 |
| B81C1/00825 | 4 |
| B81C1/00269 | 4 |
| H10W76/12 | 4 |