Apparatus and method for making a secured substrate
US-2024355722-A1 · Oct 24, 2024 · US
characterised by their shape
characterised by their shape · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W76/12 |
| Official title | characterised by their shape |
| Display label | characterised by their shape |
| Total patents | 2,636 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 135 |
| 2016 | 164 |
| 2017 | 163 |
| 2018 | 235 |
| 2019 | 244 |
| 2020 | 265 |
| 2021 | 278 |
| 2022 | 285 |
| 2023 | 313 |
| 2024 | 262 |
| 2025 | 243 |
| 2026 | 49 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTROMAGNETIC ISOLATION (EMI) SHIELD STRUCTURES AND RELATED METHODS
US-2024021538-A1 · Jan 18, 2024 · US
Package architecture of scalable compute wall having compute bricks with vertically stacked dies
US-2024006395-A1 · Jan 4, 2024 · US
Thermal interface material on package
US-2015364342-A1 · Dec 17, 2015 · US
Semiconductor device with covering member that partially covers wiring substrate
US-2015364392-A1 · Dec 17, 2015 · US
Thermal interface material on package
US-2015364343-A1 · Dec 17, 2015 · US
Electronic control device
US-9214406-B2 · Dec 15, 2015 · US
Hidden plating traces
US-9209159-B2 · Dec 8, 2015 · US
Power semiconductor module
US-9209099-B1 · Dec 8, 2015 · US
Double-sided package
US-9209121-B2 · Dec 8, 2015 · US
Methods of fabricating fan-out wafer level packages and packages formed by the methods
US-9202716-B2 · Dec 1, 2015 · US
Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package
US-9202789-B2 · Dec 1, 2015 · US
Holding of interposers and other microelectronic workpieces in position during assembly and other processing
US-2015333049-A1 · Nov 19, 2015 · US
Semiconductor device and method of manufacturing the semiconductor device
US-2015303126-A1 · Oct 22, 2015 · US
Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
US-2015303110-A1 · Oct 22, 2015 · US
Semiconductor device and method of manufacturing the same
US-9153510-B2 · Oct 6, 2015 · US
Shielding technique for semiconductor package including metal lid and metalized contact area
US-9153543-B1 · Oct 6, 2015 · US
Packages and methods for packaging
US-9142470-B2 · Sep 22, 2015 · US
Semiconductor device with covering member that partially covers wiring substrate
US-9142519-B2 · Sep 22, 2015 · US
Dam for Three-Dimensional Integrated Circuit
US-2015262900-A1 · Sep 17, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W76/12?
- CPC H10W76/12 is the Cooperative Patent Classification code for “characterised by their shape.”
- How many patents are filed under CPC H10W76/12 (characterised by their shape)?
- Our database includes 2,636 publications tagged with this CPC code.
- Is patent activity under CPC H10W76/12 growing?
- Publication counts under this code: 262 in 2024 vs 243 in 2025 (latest complete years).