Wound capacitor packaging structure and sealing element thereof
US-2026074124-A1 · Mar 12, 2026 · US
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Lin Chieh patents
Lin Chieh is listed as an inventor on 48 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lin Chieh |
| Total patents | 48 |
| First publication | Dec 7, 2017 |
| Latest publication | Mar 12, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor gate structure and methods of forming the same
US-2025351541-A1 · Nov 13, 2025 · US
Semiconductor gate structure and methods of forming the same
US-2025338599-A1 · Oct 30, 2025 · US
Wound capacitor package structure
US-12354810-B2 · Jul 8, 2025 · US
Capacitor assembly package structure and method of manufacturing the same, and electronic device
US-2025087420-A1 · Mar 13, 2025 · US
Capacitor assembly package structure, capacitor structure and method of manufacturing the same, and electronic device
US-2025087428-A1 · Mar 13, 2025 · US
Laterally placed capacitor package assembly and assembly method thereof
US-2024431032-A1 · Dec 26, 2024 · US
Stacked capacitor assembly and method of manufacturing the same, and stacked capacitor package structure
US-2024428991-A1 · Dec 26, 2024 · US
Method for manufacturing semi-solid electrolytic capacitor
US-2024312727-A1 · Sep 19, 2024 · US
Conductive paste, manufacturing method thereof, capacitor element and manufacturing method thereof
US-2024266119-A1 · Aug 8, 2024 · US
Recent patents
Latest publications not already listed above.
Wound capacitor package structure
US-2024153708-A1 · May 9, 2024 · US
Method of manufacturing capacitor assembly package structure
US-11854749-B2 · Dec 26, 2023 · US
Capacitor element
US-11817273-B2 · Nov 14, 2023 · US
Method of manufacturing a winding capacitor package structure
US-2023215661-A1 · Jul 6, 2023 · US
Method of manufacturing a winding capacitor package structure
US-2023215659-A1 · Jul 6, 2023 · US
Method of manufacturing capacitor assembly package structure
US-2023197354-A1 · Jun 22, 2023 · US
Winding capacitor package structure and method of manufacturing the same
US-11640878-B2 · May 2, 2023 · US
Winding capacitor package structure and method of manufacturing the same
US-11640879-B2 · May 2, 2023 · US
Capacitor assembly package structure
US-11626255-B2 · Apr 11, 2023 · US
Stacked solid electrolytic capacitor, integrated circuit product and electronic product
US-11610741-B2 · Mar 21, 2023 · US
Winding-type capacitor package structure and method of manufacturing the same
US-11488786-B2 · Nov 1, 2022 · US
Capacitor element and method for manufacturing the same
US-11404218-B2 · Aug 2, 2022 · US
Capacitor assembly structure and method of manufacturing the same
US-11335512-B2 · May 17, 2022 · US
Stacked solid electrolytic capacitor, integrated circuit product and electronic product
US-2022139637-A1 · May 5, 2022 · US
Method for manufacturing electrolytic capacitor
US-2022130619-A1 · Apr 28, 2022 · US
Method for manufacturing electrolytic capacitor
US-2022127414-A1 · Apr 28, 2022 · US
Winding capacitor package structure and method of manufacturing the same
US-2021391119-A1 · Dec 16, 2021 · US
Winding capacitor package structure and method of manufacturing the same
US-2021391118-A1 · Dec 16, 2021 · US
Method for forming polymer composite material onto capacitor element
US-11177075-B2 · Nov 16, 2021 · US
Capacitor assembly package structure and method of manufacturing the same
US-2021327651-A1 · Oct 21, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Apaq Technology Co Ltd | 45 |
| Taiwan Semiconductor Mfg Co Ltd | 2 |
| Synology Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.