Winding-type capacitor package structure and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-11488786-B2
Application number	US-202017024897-A
Country	US
Kind code	B2
Filing date	Sep 18, 2020
Priority date	Mar 17, 2020
Publication date	Nov 1, 2022
Grant date	Nov 1, 2022

Abstract

A winding-type capacitor package structure and a method of manufacturing the same are provided. The winding-type capacitor package structure includes a winding assembly, a package assembly and a conductive assembly. The winding assembly includes a winding conductive positive foil and a winding conductive negative foil. The package assembly fully encloses the winding assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The package assembly includes a casing structure, a filling body and a bottom enclosing structure. The casing structure has an accommodating space for receiving the winding assembly. The filling body is filled in the accommodating space for surrounding the winding assembly. The bottom enclosing structure is disposed on a bottom portion of the casing structure for carrying the winding assembly and enclosing the accommodating space. The bottom enclosing structure is surrounded by the casing structure and tightly connected to the filling body.

First claim

What is claimed is:

1. A winding-type capacitor package structure, comprising:
a winding assembly including a winding conductive positive foil, a winding conductive negative foil and two winding insulating separators;
a package assembly fully enclosing the winding assembly; and
a conductive assembly including a first conductive pin electrically connected to the winding conductive positive foil and a second conductive pin electrically connected to the winding conductive negative foil;
wherein one of the two winding insulating separators is disposed between the winding conductive positive foil and the winding conductive negative foil, and one of the winding conductive positive foil and the winding conductive negative foil is disposed between the two winding insulating separators;
wherein the first conductive pin includes a first embedded portion enclosed inside the package assembly and a first exposed portion exposed outside the package assembly, and the second conductive pin includes a second embedded portion enclosed inside the package assembly and a second exposed portion exposed outside the package assembly;
wherein the package assembly includes a casing structure, a filling body and a bottom enclosing structure, the casing structure has an accommodating space for receiving the winding assembly, and the filling body is filled in the accommodating space for surrounding the winding assembly;
wherein the bottom enclosing structure is disposed on a bottom portion of the casing structure for carrying the winding assembly and enclosing the accommodating space, and the bottom enclosing structure is surrounded by the casing structure and is tightly connected to the filling body;
wherein the filling body includes a first filling material and a second filling material connected to and different from the first filling material, the bottom enclosing structure is tightly connected to the first filling material, and the second filling material and the bottom enclosing structure are separate from each other;
wherein the bottom enclosing structure includes a first moisture barrier layer and a second moisture barrier layer respectively disposed on two opposite surfaces thereof, and the first moisture barrier layer is tightly connected to the first filling material;
wherein a viscosity coefficient of the first filling material is greater than a viscosity coefficient of the second filling material;
wherein the winding assembly includes a first surrounding region surrounded by the first filling material and a second surrounding region surrounded by the second filling material, and the first surrounding region is smaller than the second surrounding region.

2. The winding-type capacitor package structure according to claim 1 , wherein a heat conductivity coefficient of the first filling material is greater than, equal to or smaller than a heat conductivity coefficient of the second filling material; wherein the bottom enclosing structure has at least two opening holes, the first embedded portion of the first conductive pin and the second embedded portion of the second conductive pin are respectively disposed inside the at least two opening holes of the bottom enclosing structure, and the first exposed portion of the first conductive pin and the second exposed portion of the second conductive pin are respectively disposed outside the at least two opening holes of the bottom enclosing structure.

3. The winding-type capacitor package structure according to claim 1 , further comprising: a protective bottom cover disposed on the bottom portion of the casing structure so as to cooperate with the casing structure; wherein the protective bottom cover includes a covering portion for protecting the bottom enclosing structure and a matching portion for matching with the casing structure, the covering portion of the protective bottom cover is disposed on the bottom portion of the casing structure for contacting and covering the bottom enclosing structure, and the matching portion of the protective bottom cover is extended upwardly from a periphery of the covering portion for surrounding and contacting the casing structure; wherein the bottom enclosing structure has at least two opening holes, the protective bottom cover has at least two through holes, the first embedded portion of the first conductive pin and the second embedded portion of the second conductive pin are respectively disposed inside the at least two opening holes of the bottom enclosing structure and respectively disposed inside the at least two through holes of the protective bottom cover, and the first exposed portion of the first conductive pin and the second exposed portion of the second conductive pin are respectively disposed outside the at least two opening holes of the bottom enclosing structure and respectively disposed outside the at least two through holes of the protective bottom cover.

4. A winding-type capacitor package structure, comprising:
a winding assembly including a winding conductive positive foil and a winding conductive negative foil;
a package assembly fully enclosing the winding assembly; and
a conductive assembly including a first conductive pin electrically connected to the winding conductive positive foil and a second conductive pin electrically connected to the winding conductive negative foil;
wherein the package assembly includes a casing structure, a filling body and a bottom enclosing structure, the casing structure has an accommodating space for receiving the winding assembly, and the filling body is filled in the accommodating space for surrounding the winding assembly;
wherein the bottom enclosing structure is disposed on a bottom portion of the casing structure for carrying the winding assembly and enclosing the accommodating space, and the bottom enclosing structure is surrounded by the casing structure and is tightly connected to the filling body;
wherein the bottom enclosing structure is fixed inside the casing structure without changing a shape of the casing structure or without using a deformation portion of the casing structure;
wherein the filling body includes a first filling material and a second filling material connected to the first filling material, the bottom enclosing structure is tightly connected to the first filling material, and the second filling material and the bottom enclosing structure are separate from each other;
wherein the bottom enclosing structure includes a first moisture barrier layer and a second moisture barrier layer respectively disposed on two opposite surfaces thereof, and the first moisture barrier layer is tightly connected to the first filling material;
wherein a viscosity coefficient of the first filling material is greater than a viscosity coefficient of the second filling material;
wherein the winding assembly includes a first surrounding region surrounded by the first filling material and a second surrounding region surrounded by the second filling material, and the first surrounding region is smaller than the second surrounding region.

5. The winding-type capacitor package structure according to claim 4 , wherein a heat conductivity coefficient of the first filling material is greater than, equal to or smaller than a heat conductivity coefficient of the second filling material; wherein the bottom enclosing structure has at least two opening holes, a first embedded portion of the first conductive pin and a second embedded portion of the second conductive pin are respectively disposed inside the at least two opening holes of the bottom enclosing structure, and a first exposed portion of the first conductive pin and a second exposed portion of the second conductive pin are respectively disposed outside the at least two opening holes of the bottom enclosing structure.

6. The win

Assignees

• Apaq Technology Co Ltd

Inventors

• Lin Chieh
• Su Chung-Jui
• Lin Ching-Feng
• Chen Ming-Tsung

Classifications

• H01G9/151 Primary

  with wound foil electrodes · CPC title

• H01G9/10

  Sealing, e.g. of lead-in wires · CPC title

• H01G9/012

  specially adapted for solid capacitors · CPC title

• H01G9/08

  Housing; Encapsulation · CPC title