Winding capacitor package structure and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-11640879-B2
Application number	US-202017022303-A
Country	US
Kind code	B2
Filing date	Sep 16, 2020
Priority date	Jun 10, 2020
Publication date	May 2, 2023
Grant date	May 2, 2023

Abstract

A winding-type capacitor package structure and a method of manufacturing the same are provided. The winding-type capacitor package structure includes a winding assembly, a package assembly, a conductive assembly, and a bottom carrier frame. The winding assembly includes a positive winding conductive foil and a negative winding conductive foil. The winding assembly is enclosed by the package assembly. The package assembly includes a casing structure and a filling body received inside the casing structure. The casing structure has an inner rough surface. The bottom carrier frame is disposed on a bottom portion of the casing structure. The filling body includes a plurality of layered structures, and each of the layered structure is connected between the winding assembly and the casing structure. Therefore, the filling body including the layered structures can be limited inside the casing structure through friction force provided by the inner rough surface.

First claim

What is claimed is:

1. A winding capacitor package structure, comprising:
a winding assembly including a winding positive foil, a winding negative foil and two winding insulating separators;
a package assembly for completely enclosing the winding assembly, wherein the package assembly includes a casing structure and a filling body, the casing structure includes an accommodating space for receiving the winding assembly, and the filling body is received inside the accommodating space for completely enveloping the winding assembly;
a conductive assembly including a first conductive pin electrically contacting the winding positive foil and a second conductive pin electrically contacting the winding negative foil; and
a bottom carrier frame disposed on a bottom portion of the casing structure so as to protect the filling body and match with the casing structure;
wherein one of the two winding insulating separators is disposed between the winding positive foil and the winding negative foil, and one of the winding positive foil and the winding negative foil is disposed between the two winding insulating separators;
wherein the first conductive pin includes a first embedded portion enclosed inside the package assembly and a first exposed portion exposed outside the package assembly, and the second conductive pin includes a second embedded portion enclosed inside the package assembly and a second exposed portion exposed outside the package assembly;
wherein the filling body includes a plurality of layered structures stacked on top of one another in sequence, each of the layered structures is connected between the winding assembly and the casing structure, and the layered structures have the same or different filling materials;
wherein the casing structure includes a rough inner surface, and the filling body is limited inside the casing structure through a friction provided by the rough inner surface of the casing structures;
wherein both the first conductive pin and the second conductive pin are separate from the filling body;
wherein the casing structure includes a retaining body is a single body disposed around the filling body;
wherein an enclosed moisture barrier layer contacts an entire outer surface of the winding assembly.

2. The winding capacitor package structure according to claim 1 , wherein the filling body includes a base layer disposed between an inner bottom surface of the casing structure and a top surface of the winding assembly, and a plurality of filling layers stacked on top of one another in sequence and disposed on the base layer, the bottom carrier frame is tightly connected to an outermost one of the filling layers, and the other filling layers are spaced apart from the bottom carrier frame; wherein a viscosity coefficient of the base layer is different from or equals to a viscosity coefficient of the filling layer, and a heat conductivity coefficient of the base layer is different from or equals to a heat conductivity coefficient of the filling layer; wherein a first junction between the winding assembly and the first conductive pin and a second junction between the winding assembly and the second conductive pin are covered by the enclosed moisture barrier layer; wherein the casing structure includes a main casing for enclosing the base layer and the filling body and the retaining body is inwardly bent from a bottom side of the main casing, and the base layer and the filling body is retained and limited inside the casing structure by the retaining body.

3. The winding capacitor package structure according to claim 1 , wherein the filling body includes a base layer disposed between an inner bottom surface of the casing structure and a top surface of the winding assembly, and a plurality of filling layers stacked on top of one another in sequence and disposed on the base layer, the bottom carrier frame is tightly connected to an outermost one of the filling layers, and the other filling layers are spaced apart from the bottom carrier frame; wherein a viscosity coefficient of the base layer is different from or equals to a viscosity coefficient of the filling layer, and a heat conductivity coefficient of the base layer is different from or equals to a heat conductivity coefficient of the filling layer; wherein a part of the first conductive pin is surrounded by a first moisture barrier layer, and a first junction between the winding assembly and the first conductive pin is covered by the first moisture barrier layer; wherein a part of the second conductive pin is surrounded by a second moisture barrier layer, and a second junction between the winding assembly and the second conductive pin is covered by the second moisture barrier layer; wherein the casing structure includes a main casing for enclosing the base layer and the filling body and the retaining body is inwardly bent from a bottom side of the main casing, and the base layer and the filling body is retained and limited inside the casing structure by the retaining body.

4. The winding capacitor package structure according to claim 1 , wherein the bottom carrier frame includes a covering portion for contacting and covering the filling body, and a matching portion for matching with the casing structure, and the matching portion is downwardly extended from an outer periphery of the covering portion in order to surround and contact the casing structure; wherein the bottom carrier frame includes at least two through holes, a part of the first exposed portion of the first conductive pin and a part of the second exposed portion of the second conductive pin are respectively disposed inside the at least two through holes, and another part of the first exposed portion of the first conductive pin and another part of the second exposed portion of the second conductive pin are respectively disposed outside the at least two through holes.

5. A winding capacitor package structure, comprising:
a winding assembly including a winding positive foil and a winding negative foil;
a package assembly for completely enclosing the winding assembly, wherein the package assembly includes a casing structure and a filling body received inside the casing structure;
a conductive assembly including a first conductive pin electrically contacting the winding positive foil and a second conductive pin electrically contacting the winding negative foil; and
a bottom carrier frame disposed on a bottom portion of the casing structure so as to protect the filling body and match with the casing structure;
wherein the filling body includes a plurality of layered structures, and each of the layered structures is connected between the winding assembly and the casing structure;
wherein the casing structure includes a rough inner surface, and the filling body is limited inside the casing structure through a friction provided by the rough inner surface of the casing structure;
wherein both the first conductive pin and the second conductive pin are separate from the filling body;
wherein the casing structure includes a retaining body is a single body disposed around the filling body;
wherein an enclosed moisture barrier layer contacts an entire outer surface of the winding assembly.

6. The winding capacitor package structure according to claim 5 , wherein the filling body includes a base layer disposed between an inner bottom surface of the casing structure and a top surface of the winding assembly, and a plurality of filling layers stacked on top of one another in sequence and disposed on the base layer, the bottom carrier frame is tightly connected to an outermost one of the filling layers, and the other filling layers are spaced apart from the bottom carrier frame; wherein a viscosity coefficient of the base layer is different from or equals to a viscosity coefficient

Assignees

• Apaq Technology Co Ltd

Inventors

• Lin Chieh
• Su Chung-Jui

Classifications

• H01G2/106

  Fixing the capacitor in a housing · CPC title

• H01G9/151

  with wound foil electrodes · CPC title

• H01G4/32 Primary

  Wound capacitors · CPC title

• H01G9/06

  Mounting in containers · CPC title

• H01G11/78

  Cases; Housings; Encapsulations; Mountings · CPC title