Capacitor assembly package structure

Patent metadata

Field	Value
Publication number	US-11626255-B2
Application number	US-202017024875-A
Country	US
Kind code	B2
Filing date	Sep 18, 2020
Priority date	Apr 15, 2020
Publication date	Apr 11, 2023
Grant date	Apr 11, 2023

Abstract

A capacitor assembly package structure and a method of manufacturing the same are provided. The capacitor assembly package structure includes a capacitor unit, an insulative package body, a conductive connection layer and an electrode unit. The capacitor unit includes a plurality of capacitors, and each capacitor includes a positive portion and a negative portion. The insulative package body partially encloses the capacitors, and the positive portion has a positive lateral surface exposed from a first lateral surface of the insulative package body. The conductive connection layer is electrically connected to the negative portion. The electrode unit includes a first electrode structure and a second electrode structure. The first electrode structure encloses a first portion of the insulative package body and electrically connects to the positive portion, and the second electrode structure encloses a second portion of the insulative package body and electrically connects to the conductive connection layer.

First claim

The invention claimed is:

1. A capacitor assembly package structure, comprising:
a capacitor unit including a plurality of capacitors, wherein each of the capacitors includes a positive portion and a negative portion;
an insulative package body for partially enclosing the capacitors, wherein the positive portion of each of the capacitors has a positive lateral surface exposed from a first lateral surface of the insulative package body;
a conductive connection layer electrically connected to the negative portion of each of the capacitors;
an electrode unit including a first electrode structure and a second electrode structure, wherein the first electrode structure encloses a first portion of the insulative package body and electrically connects to the positive portion of each of the capacitors, and the second electrode structure encloses a second portion of the insulative package body and electrically connects to the conductive connection layer; and
a negative composite material layer disposed on a second lateral surface of the insulative package body and a lateral surface of the conductive connection layer so as to electrically connect to the negative portion of the capacitor, wherein the second electrode structure electrically contacts the negative composite material layer;
wherein the negative composite material layer includes at least two negative conductive layers that are divided into a first negative conductive layer disposed on the second lateral surface of the insulative package body and the lateral surface of the conductive connection layer, and a second negative conductive layer for covering the first negative conductive layer;
wherein the first negative conductive layer has a first top plane surface covered by the second negative conductive layer, and a first surrounding surface connected with the first top plane surface, and the second negative conductive layer has a second top plane surface covered by the second electrode structure, and a second surrounding surface connected with the second top plane;
wherein the first electrode structure includes a first inner conductive layer covering the first portion of the insulative package body and being electrically connected to the positive portion of the capacitor, a first middle conductive layer covering the first inner conductive layer, and a first outer conductive layer covering the first middle conductive layer;
wherein the second electrode structure includes a second inner conductive layer covering the second portion of the insulative package body and being electrically connected to the conductive connection layer, a second middle conductive layer covering the second inner conductive layer, and a second outer conductive layer covering the second middle conductive layer;
wherein the insulative package body has a top surface and a bottom surface opposite to the top surface, the top surface and the bottom surface of the insulative package body are connected between the first lateral surface and the second lateral surface;
wherein the first electrode structure and the second electrode structure contact the top surface and the bottom surface of the insulative package body;
wherein the negative composite material layer is only disposed on the second lateral surface of the insulative package body.

2. The capacitor assembly package structure according to claim 1 , further comprising: a plurality of positive composite material layers each disposed on the first lateral surface of the insulative package body and the positive lateral surface of the corresponding positive portion so as to electrically connect to the positive portion of the corresponding capacitor; wherein the first electrode structure electrically contacts the positive composite material layers, each of the positive composite material layers includes at least two positive conductive layers, and the positive conductive layers are made of Pt, Pd, Ti, or Cr; wherein the first lateral surface of the insulative package body and the positive lateral surface of the positive portion are flush with each other, and the positive composite material layer has a plane contacting the first lateral surface of the insulative package body and the positive lateral surface of the positive portion.

3. The capacitor assembly package structure according to claim 1 , wherein the negative conductive layers are made of Pt, Pd, Ti, or Cr; wherein the second lateral surface of the insulative package body and the lateral surface of the conductive connection layer are flush with each other, and the negative composite material layer has a plane contacting the second lateral surface of the insulative package body and the lateral surface of the conductive connection layer.

4. The capacitor assembly package structure according to claim 1 , wherein both the first inner conductive layer and the second inner conductive layer are Ag layers, both the first middle conductive layer and the second middle conductive layer are Ni layers, and both the first outer conductive layer and the second outer conductive layer are Sn layers.

5. The capacitor assembly package structure according to claim 1 , wherein each of the capacitors includes a substrate, a conductive polymer layer enclosing a portion of the substrate, a carbon paste layer fully enclosing the conductive polymer layer, and a silver paste layer fully enclosing the carbon paste layer; wherein each of the capacitors includes a surrounding insulative layer disposed on an outer surface of the substrate and around the substrate, and lengths of the conductive polymer layer, the carbon paste layer and the silver paste layer of the capacitor are limited by the surrounding insulative layer; wherein the first lateral surface of the insulative package body, the positive lateral surface of the positive portion and a lateral surface of the surrounding insulative layer are flush with each other.

6. A capacitor assembly package structure, comprising:
a capacitor including a positive portion, a negative portion and a surrounding insulative layer;
an insulative package body for partially enclosing the capacitor, wherein the positive portion of the capacitor has a positive lateral surface exposed from a first lateral surface of the insulative package body;
a conductive connection layer electrically connected to the negative portion of the capacitor;
an electrode unit including a first electrode structure and a second electrode structure, wherein the first electrode structure encloses a first portion of the insulative package body and electrically connects to the positive portion of the capacitor, and the second electrode structure encloses a second portion of the insulative package body and electrically connects to the conductive connection layer; and
a negative composite material layer disposed on a second lateral surface of the insulative package body and a lateral surface of the conductive connection layer so as to electrically connect to the negative portion of the capacitor, wherein the second electrode structure electrically contacts the negative composite material layer;
wherein the first lateral surface of the insulative package body, the positive lateral surface of the positive portion and a lateral surface of the surrounding insulative layer are flush with each other;
wherein the negative composite material layer includes a first negative conductive layer disposed on the second lateral surface of the insulative package body and the lateral surface of the conductive connection layer, and a second negative conductive layer for covering the first negative conductive layer;
wherein the first negative conductive layer has a first top plane surface covered by the second negative conductive layer, and a first surrounding surface connected with the first top plane surface, and th

Assignees

• Apaq Technology Co Ltd

Inventors

• Lin Chieh

Classifications

• H01G9/0029

  Processes of manufacture · CPC title

• H01G9/012 Primary

  specially adapted for solid capacitors · CPC title

• H01G9/26

  Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other · CPC title

• H01G9/15

  Solid electrolytic capacitors (H01G11/00 takes precedence) · CPC title

• H01G9/08 Primary

  Housing; Encapsulation · CPC title