Method for manufacturing package structure
US-12021037-B2 · Jun 25, 2024 · US
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Lin Cheng-Ping patents
Lin Cheng-Ping is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lin Cheng-Ping |
| Total patents | 10 |
| First publication | May 10, 2018 |
| Latest publication | Jun 25, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for manufacturing package structure
US-2023098830-A1 · Mar 30, 2023 · US
Package structure
US-11532564-B2 · Dec 20, 2022 · US
Package structure and method for manufacturing the same
US-2021098384-A1 · Apr 1, 2021 · US
Method for manufacturing package structure
US-10867932-B2 · Dec 15, 2020 · US
Method for manufacturing package structure
US-2020152576-A1 · May 14, 2020 · US
Package structure and method for forming the same
US-10535609-B2 · Jan 14, 2020 · US
Package structure and method for forming the same
US-2018308800-A1 · Oct 25, 2018 · US
Package structure and method for forming the same
US-10014260-B2 · Jul 3, 2018 · US
Package structure and method for forming the same
US-2018130749-A1 · May 10, 2018 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 10 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/00 | 10 |
| H10W74/142 | 10 |
| H10W74/15 | 10 |
| H10W90/00 | 10 |
| H10W72/0198 | 10 |