Semiconductor packages having EMI shielding layers
US-10923434-B2 · Feb 16, 2021 · US
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Lim Sang Joon patents
Lim Sang Joon is listed as an inventor on 12 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lim Sang Joon |
| Total patents | 12 |
| First publication | Jan 5, 2016 |
| Latest publication | Feb 16, 2021 |
Notable patents
Publications ranked by popularity score, then publication date.
Stacked semiconductor package having an interposer
US-2020402959-A1 · Dec 24, 2020 · US
Semiconductor package having an electro-magnetic interference shielding or electro-magnetic wave scattering structure
US-10615129-B2 · Apr 7, 2020 · US
Semiconductor packages having emi shielding layers
US-2019333865-A1 · Oct 31, 2019 · US
Package substrates with signal transmission paths relating to parasitic capacitance values
US-2019080999-A1 · Mar 14, 2019 · US
Semiconductor package having an electro-magnetic interference shielding or electro-magnetic wave scattering structure
US-2019081009-A1 · Mar 14, 2019 · US
Semiconductor package having an electro-magnetic interference shielding or electro-magnetic wave scattering structure
US-10157858-B2 · Dec 18, 2018 · US
Semiconductor package having a redistribution line structure
US-10115708-B2 · Oct 30, 2018 · US
Semiconductor package having an electro-magnetic interference shielding or electro-magnetic wave scattering structure
US-2018247897-A1 · Aug 30, 2018 · US
Semiconductor package having a redistribution line structure
US-2018138150-A1 · May 17, 2018 · US
Recent patents
Latest publications not already listed above.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Sk Hynix Inc | 12 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/65 | 11 |
| H10W70/60 | 9 |
| H10W74/117 | 9 |
| H10W72/20 | 8 |
| H10W42/20 | 7 |