Data processing method and apparatus
US-2022248259-A1 · Aug 4, 2022 · US
Lei Kai is listed as an inventor on 20 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lei Kai |
| Total patents | 20 |
| First publication | Aug 25, 2016 |
| Latest publication | Aug 4, 2022 |
Publications ranked by popularity score, then publication date.
US-2022248259-A1 · Aug 4, 2022 · US
US-10868495-B2 · Dec 15, 2020 · US
US-10523153-B2 · Dec 31, 2019 · US
US-2019386612-A1 · Dec 19, 2019 · US
US-10355986-B2 · Jul 16, 2019 · US
US-10334020-B2 · Jun 25, 2019 · US
US-2019132282-A1 · May 2, 2019 · US
US-10116428-B2 · Oct 30, 2018 · US
US-2018309666-A1 · Oct 25, 2018 · US
US-2018248932-A1 · Aug 30, 2018 · US
Latest publications not already listed above.
US-2018198409-A1 · Jul 12, 2018 · US
US-9948234-B2 · Apr 17, 2018 · US
US-9887733-B2 · Feb 6, 2018 · US
US-2017237464-A1 · Aug 17, 2017 · US
US-9722643-B2 · Aug 1, 2017 · US
US-9673959-B2 · Jun 6, 2017 · US
US-2017085359-A1 · Mar 23, 2017 · US
US-2016285483-A1 · Sep 29, 2016 · US
US-2016248376-A1 · Aug 25, 2016 · US
US-2016248574-A1 · Aug 25, 2016 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lattice Semiconductor Corp | 12 |
| Univ Peking Shenzhen Graduate School | 5 |
| Silicon Image Inc | 3 |
| Huawei Tech Co Ltd | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H04L5/14 | 6 |
| H03L7/099 | 6 |
| H03B5/04 | 6 |
| H04L5/1461 | 6 |
| H04L67/63 | 5 |