Aluminum compound, method of forming thin film by using the same, and method of fabricating integrated circuit device
US-10224200-B2 · Mar 5, 2019 · US
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LEE Sung-duck patents
LEE Sung-duck is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | LEE Sung-duck |
| Total patents | 2 |
| First publication | Mar 15, 2018 |
| Latest publication | Mar 5, 2019 |
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 2 |
| Dnf Co Ltd | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P50/283 | 2 |
| H10P50/73 | 2 |
| H10P14/6518 | 2 |
| H10P14/6339 | 2 |
| H10P14/668 | 2 |