Communication device and image display apparatus including the same
US-12574862-B2 · Mar 10, 2026 · US
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Lee Sinjae patents
Lee Sinjae is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Sinjae |
| Total patents | 10 |
| First publication | Jan 20, 2015 |
| Latest publication | Mar 10, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Apparatus for applying graphic effect and method therefor
US-12511803-B2 · Dec 30, 2025 · US
Communication device and image display apparatus including the same
US-2023397124-A1 · Dec 7, 2023 · US
Apparatus for applying graphic effect and method therefor
US-2023129264-A1 · Apr 27, 2023 · US
Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV
US-9401347-B2 · Jul 26, 2016 · US
Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die
US-9379064-B2 · Jun 28, 2016 · US
Semiconductor Device and Method of Mounting Semiconductor Die to Heat Spreader on Temporary Carrier and Forming Polymer Layer and Conductive Layer Over the Die
US-2015228590-A1 · Aug 13, 2015 · US
Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die
US-9048209-B2 · Jun 2, 2015 · US
Semiconductor Device and Method of Forming a Shielding Layer Over a Semiconductor Die Disposed in a Cavity of an Interconnect Structure and Grounded Through the Die TSV
US-2015137334-A1 · May 21, 2015 · US
Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV
US-8937371-B2 · Jan 20, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Stats Chippac Ltd | 6 |
| Stats Chippac Pte Ltd | 2 |
| Lg Electronics Inc | 2 |
| Samsung Electronics Co Ltd | 2 |
| Oh Jihoon | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/117 | 6 |
| H10W74/00 | 6 |
| H10W72/884 | 6 |
| H10W70/655 | 6 |
| H10W42/20 | 6 |