Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die
US-9048209-B2 · Jun 2, 2015 · US
This page is not indexed by search engines while we improve data quality.
Oh Jihoon patents
Oh Jihoon holds 1 patent in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 1 |
| Recent patents | 0 |
| First publication | Jun 2, 2015 |
| Latest publication | Jun 2, 2015 |
Filing trend
Year-over-year patent counts for this assignee.
Not enough yearly data to assess filing trend yet.
| Year | Patents |
|---|---|
| 2015 | 1 |
| Year | Patents |
|---|---|
| 2015 | 1 |
Recent patents
Latest publications where this party is an assignee.
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W90/736 | 1 |
| H10W90/701 | 1 |
| H10W90/00 | 1 |
| H10W74/00 | 1 |
| H10W72/9413 | 1 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 1 |